Home » News » Dimensions of Reflow Soldering Oven-Shengdian SMT Equipment Factory

Dimensions of Reflow Soldering Oven-Shengdian SMT Equipment Factory

Views: 0     Author: SHENGDIAN     Publish Time: 2024-04-26      Origin: Site

Inquire

facebook sharing button
twitter sharing button
line sharing button
wechat sharing button
linkedin sharing button
pinterest sharing button
whatsapp sharing button
kakao sharing button
snapchat sharing button
sharethis sharing button

实拍10温区

The dimensions of Reflow Soldering Oven with Lead-Free are the dimensional parameters involved in the soldering process. The following Shenzhen Shengdian electronic equipment for your detailed introduction.

First of all, the most important size parameter of Reflow Soldering Machine SMT equipment is the pin size and alignment pitch of components. In the design and manufacture of PCB, you need to ensure that the component pins meet the requirements of reflow soldering equipment. Usually, the component pin size is designed according to international standards, which ensures that the components can be widely used in different soldering equipment.

Secondly, the dimensions of the Reflow Soldering Oven also include the spacing and alignment accuracy between the component and the PCB. In the soldering process, the spacing between the component and the PCB should be appropriate to ensure that the heat can be evenly distributed during reflow soldering, and to avoid the spacing is too small, resulting in the inability to solder properly. In addition, the alignment accuracy is also very important, that is, the degree of alignment between the component pins and the PCB pads. If the alignment accuracy is not enough, it will lead to poor soldering and even affect the normal operation of the whole circuit. Shengdian SMT equipment factory

In addition, different Reflow Oven styles also need to consider the size and shape of the pads between the component and the circuit board. The solder pad is the metal surface on the circuit board used to connect the component pins, usually round or square in shape. The size of the pad should be reasonably designed according to the size of the component pins to ensure soldering quality. The shape of the pad also needs to take into account the requirements of the soldering equipment and process, such as the need to leave the “solder ball” and so on.

Finally, the size of the Reflow Soldering Machine oven also involves the control of soldering temperature and time. In the welding process, according to the requirements of the components and welding materials to control the appropriate welding temperature and time. Too high a temperature or too long a time may result in poor soldering or even damage to the circuit board. Shengdian SMT equipment factory


Telephone

+86-135-5475-8169
​Copyright © 2024 SHENGDIAN ELECTRONICS. All Rights Reserved.
Technology by leadong.com

Support

About

Subscribe to our newsletter

Promotions, new products and sales. Directly to your inbox.