Brief:The Repair Worktable, with its compact structure and precise temperature control capabilities, demonstrates significant advantages in specific scenarios. The following is an analysis of core application scenarios and technical highlights: Core Application Scenarios Micro PCB Repair Station Suitable for repairing small boards ranging from 11×7 cm to 13×13 cm (such as smartwatch mainboards and TWS earphone circuits), with a desktop footprint reduced by 60% compared to standard models. Research and Development Laboratory Testing Supports rapid BGA chip desoldering (±2°C temperature control accuracy), enabling component replacement within 5 minutes to accelerate prototype validation. Educational Training Facilities Semi-automatic models combine optical alignment and touchscreen interfaces to lower the operational threshold for students.
Brief:The core features of the compact rework station are primarily reflected in its compactness, flexibility, and specialised functionality, as detailed below: 1. Compact Structural Design Compact Chassis Specifically designed for scenarios with limited repair space, the typical dimensions are compatible with PCB boards ranging from 11×7 cm to 13×13 cm (e.g., RBN/RBSM series), with a desktop footprint reduced by 60% compared to standard models. Ergonomic stand Supports vertical lifting and horizontal micro-adjustment, allowing operators to adjust the repair angle with one hand. Modular integration Integrated design of the hot air nozzle and placement head eliminates the need for external equipment, enabling ‘pick-place-solder’ single-machine operation. 2. Precise temperature control capability Efficient heating system The upper hot air nozzle achieves a heating rate of 10°C/second, combined with an infrared lower heating zone, to rapidly reach lead-free soldering temperature curves (≥217°C); Three-zone independent control models can preheat the entire PCB, eliminating the risk of thin board deformation (warpage reduced by 70%). Intelligent temperature control algorithm PID closed-loop regulation ensures uniform melting of solder joints, preventing chip overheating damage, and is compatible with 0.3mm micro-pitch BGA rework.
Brief:Main Features of SD-350 Touch Screen BGA Rework Station:Self-developed upper and lower heating air volume adjustment function, large chip or small chip, large air volume or small air volume, to ensure the welding effect! Unique infrared fixed point function, more convenient and quick positioning BGA chip.Adopt independently developed man-machine interface, the function can be seen, simple operation interface can be seen clearly at a glance.Unique one-key curve generation function, more convenient, easier to operate.Adopt each temperature zone separate heating function. The upper and lower heaters and the bottom heaters display three real-time temperature curves in the screen over time. The temperature is accurately controlled within ±0.1 degrees (the actual control is within ±3 degrees, the accuracy is affected by the environment). The upper and lower heaters can be controlled in up to 9 stages.The hot air nozzle can rotate 360°; The bottom infrared heating plate can make the PCB board heat evenly.The machine adopts high precision K-type thermocouple closed-loop control, external temperature measuring interface to realize the precise temperature detection.PCB board positioning using infrared plus V-shaped slot, portable flexible universal pin fixture to protect PCB board.High power cross flow fan is used to cool PCB board quickly and improve working efficiency.The machine has the function of alarm after welding work is finished, and the function of "alarm in advance" is specially added for the convenience of users.Intelligent temperature sensing system, prevent temperature overtemperature, with temperature limit function, better protection of work.
