Brief:The nozzle cleaning machine is a core auxiliary device in SMT assembly production lines, specifically designed to clean solder paste, flux, and other contaminants accumulated on the surface and interior of pick-and-place machine nozzles. Its primary functions include ensuring placement accuracy, reducing material waste, and enhancing production efficiency. Its functional value and technical implementation are as follows: Removing blockages to ensure stable adhesion Using high-pressure water mist (0.4–0.5 MPa) or ultrasonic cavitation effects (>40 kHz), the machine deeply cleans the inner walls of the nozzle (with pore sizes as small as 0.2 mm), completely breaking down solidified solder paste and adhesive residues. This prevents vacuum suction force reduction caused by blockages, thereby reducing the pick-and-place machine's scrap rate (by up to 30–50%). Extend nozzle service life Non-destructive cleaning technology (non-contact spraying) protects the nozzle surface coating and reflective plate structure, preventing physical damage caused by traditional steel needle scrubbing or ultrasonic cleaning, extending nozzle service life to over 3,000 cycles and reducing spare part procurement costs. Improve placement accuracy and yield rate Ensure the nozzle hole walls are smooth and residue-free, maintaining stable component pickup accuracy (especially for micro-components such as 0201 chips and Mini LEDs), reducing defects such as placement offset and tombstoning, and lowering SMT soldering defect rates by 35%–40%.
Brief:The Screen Stencil Cleaning Machine is a critical piece of equipment in SMT (Surface Mount Technology) production lines, specifically designed to remove residues such as solder paste and red glue from the surface of steel meshes, ensuring printing accuracy and production continuity. Its core functions and technical implementation are as follows: Removing residues to prevent blockages Efficiently removes solidified solder paste particles (including solder powder and flux) and red glue residues from the mesh openings of the steel mesh, preventing blockages that cause printing misalignment and uneven solder paste distribution. This reduces焊接 defects such as cold solder joints and bridging from the source. Example: When printing with an uncleaned steel mesh, blockages in the mesh openings reduce solder paste transfer by 30%, leading to component detachment. Extend steel mesh lifespan Flux in solder paste corrodes the steel mesh surface. Regular deep cleaning can extend the steel mesh lifespan to 3,000 uses or more (uncleaned steel mesh lifespan is reduced by 30%–50%). Improve printing quality and yield rate Ensuring no residue on the mesh edges allows solder paste to transfer to PCB pads in precise shapes/volumes, reducing SMT welding defect rates by 35%–40%.
Brief:A PCB Board Dust Cleaning Machine is an automated device specifically designed for removing dust, debris, and static electricity during the manufacturing process of printed circuit boards (PCBs). Its core function is to ensure product quality, improve yield rates, and maintain production safety. Core Dust Removal Functions Removal of Processing Dust and Debris Removes metal dust and resin debris (particle size ≤5μm) generated during PCB drilling and cutting, preventing blockage of micro-holes or adhesion to pads that could cause cold solder joints or short circuits, ensuring circuit conductivity. Eliminating Electrostatic Interference Integrated ion wind bars or anti-static brushes neutralise static charges accumulated on the PCB surface (surface resistance reduced to 10⁶–10⁹Ω), preventing static attraction of dust or breakdown of precision components (such as IC chips). Ensure cleanliness Remove foreign objects such as fibres, hair, and skin particles adhering to the PCB surface to meet cleanliness standards prior to optical inspection (e.g., no visible contaminants on pads).
Brief:An Anti-Static Workbench is a functional workstation that eliminates static electricity accumulation through the use of conductive materials and a grounding system. It is primarily used in fields sensitive to static electricity, such as electronics manufacturing, pharmaceuticals and chemicals, and laboratories, to ensure the safety of components and the reliability of operations. Its core functions and features are as follows: Eliminate static electricity hazards Utilising conductive work surfaces (such as graphene composite materials or anti-static fire-resistant panels) combined with a grounding system, static charges are safely directed into the ground, preventing damage to electronic components (such as chips or circuit boards). Surface resistance is consistently maintained between 10⁶ and 10⁹ Ω, effectively preventing static electricity accumulation. Ensuring production safety Preventing static sparks from causing accidents in flammable and explosive environments. Suppressing static dust adhesion to ensure product cleanliness. Enhancing operational efficiency Modular design supports expansion with accessories such as tool cabinets and lighting brackets to optimise operational workflows. Ergonomic design reduces worker fatigue and improves production efficiency.
Brief:180-Degree Belt Turning Conveyor Technical Advantages High Efficiency and Energy Saving Reduces the number of head and tail devices and motors in traditional conveying systems, lowering installed capacity and power consumption; Modular design compatible with variable frequency speed control, adapting to different conveying rhythm requirements. Low Maintenance Costs Simplified structure (only belts and guide wheels are wear parts), allowing users to perform maintenance independently; Easy installation (no professional technicians required for commissioning), supporting various mounting methods such as ground anchors or concrete foundations. Reliability and Compatibility Carbon steel/stainless steel frames are wear-resistant, with belt widths customisable from 500–1400mm; Compatible with materials such as canvas belts, anti-static PVC belts, and metal mesh belts, meeting explosion-proof or cleanroom environment requirements.
Brief:The 90 Degree Belt Turning Conveyor is an automated device specifically designed to change the direction of material conveyance. Its core function is to optimise production line layout and enhance conveyance efficiency through a 90-degree turn. Space Optimisation and Layout Integration Connecting transition points between straight conveyor lines or workshop corners, the 90-degree turn saves factory space and addresses spatial constraints. For example, in food processing workshops, it connects packaging lines with sorting lines, avoiding the need for convoluted production line layouts. Flexible Turning Conveying The conveyor belt achieves forced turning or natural bending through a fan-shaped structure or conical shaft design, smoothly conveying small to medium-sized products (such as cardboard boxes, packaging bags, and electronic components) while maintaining stable material direction. Adaptable to Various Production Scenarios Supports horizontal, inclined, and different turning angles (45°, 90°, 180°), compatible with the needs of industries such as food, pharmaceuticals, electronics, and chemicals.
Brief:Anti-Static Belt Conveyor belts are specifically designed for electrostatic-sensitive environments. They prevent static electricity build-up through special structures and materials, playing a key role in industries such as electronics and semiconductors. Eliminate electrostatic damage Conductive rubber, carbon fibre, or metal wire blended materials (surface resistance 10⁶-10⁹Ω) are used to directly dissipate static electricity, preventing breakdown of IC chips, circuit boards, and other precision components. Dust Adhesion Suppression Reduces the static electricity's attraction to dust, ensuring the cleanliness and insulation performance of electronic components. Protection in Flammable and Explosive Environments Prevents static sparks from triggering explosions in environments with dust, oil mist, or flammable gases.
Brief:The SMT Oven Furnace Temperature Tester plays a central role in temperature monitoring and process optimisation in electronic manufacturing. Its specific functions and technical value are as follows: Real-time, accurate temperature monitoring Dynamic temperature curve recording Synchronised with the PCB board as it enters the reflow oven, it uses multiple thermocouples (typically 6-32 channels) to record temperature changes in each temperature zone in real time, with a measurement accuracy of ±0.3°C. Captures data throughout the entire process from preheating → constant temperature → reflow → cooling, preventing defects such as cold solder joints and voids caused by temperature fluctuations. Temperature deviation anomaly warning Automatically triggers an alarm when temperature deviates from the set threshold (e.g., ±5°C), preventing batch scrap caused by uncontrolled furnace temperature. Process parameter optimisation Analyses temperature curve data, automatically calculates slope, peak temperature, and time window (e.g., duration maintained above 217°C), guiding engineers in adjusting chain speed and temperature zone settings.
Brief:DIP Offline Selective Soldering Machine achieves a breakthrough in core technology through precise localised soldering techniques in electronic manufacturing. Its primary applications are as follows: Resolving soldering challenges in high-density mixed-assembly boards Avoiding thermal damage to surface-mount components Traditional wave soldering requires the entire board to be immersed in tin, and high temperatures can cause surrounding surface-mount components (such as BGA chips) to remelt. Selective wave soldering uses a CNC nozzle (with a precision of 0.1mm) to spray dynamic tin waves only onto the pins of through-hole components, protecting the structural integrity of sensitive components. Eliminating micro-pitch bridging defects By independently adjusting parameters for each solder joint (temperature/time/solder volume), single-point soldering is achieved for pins with 0.5mm spacing, reducing bridging rates to below 0.03%, far below the industry average of 5% for traditional wave soldering.
