Brief:DIP Offline Selective Soldering Machine achieves a breakthrough in core technology through precise localised soldering techniques in electronic manufacturing. Its primary applications are as follows: Resolving soldering challenges in high-density mixed-assembly boards Avoiding thermal damage to surface-mount components Traditional wave soldering requires the entire board to be immersed in tin, and high temperatures can cause surrounding surface-mount components (such as BGA chips) to remelt. Selective wave soldering uses a CNC nozzle (with a precision of 0.1mm) to spray dynamic tin waves only onto the pins of through-hole components, protecting the structural integrity of sensitive components. Eliminating micro-pitch bridging defects By independently adjusting parameters for each solder joint (temperature/time/solder volume), single-point soldering is achieved for pins with 0.5mm spacing, reducing bridging rates to below 0.03%, far below the industry average of 5% for traditional wave soldering.
Brief:The DIP Lifting Plug-in Line (lifting DIP production line) is an intelligent upgrade of the traditional plug-in line. Its core advantages are reflected in three dimensions: flexible production, human-machine collaboration, and process optimisation. The following is a detailed analysis: Dynamic adaptation to production needs (flexible manufacturing) Highly adjustable The track height can be precisely adjusted within the range of 0.8-1.4m (accuracy ±5mm) through the electronic control system. Application Scenarios: Adapting to operators of different heights (e.g., 155cm female workers vs. 185cm male workers), reducing lower back strain by 30% Raising the track during production of large automotive electronic boards (≥1.2m) to prevent board edge collisions Efficient handling of double-sided mixed-assembly boards The lifting mechanism enables automatic rotation of PCB boards from 0° to 90° to 180° (speed ≤ 3 seconds per cycle) Benefits: Double-sided assembly boards can be transferred without disassembly, reducing process intervals by 40%
Brief:Features: Appearance: streamlined design, internal modular design, suitable for SMT and straight-element lead-free welding. The spray system uses a centrifugal fan to prevent the flux from dripping onto the PCB. External flux buffer tank sensor, more reliable and durable. Standard cold air knife to prevent flux fog from spreading outward, reducing pollution. Double-wave control adopts infinite-frequency conversion technology, which can control the wave peak height independently.1 / 4HP high power peak motor, maximum peak height up to 15mm. With overtemperature sound and light alarms and an emergency braking system, all motors have overload protection. The transportation system adopts infinite electronic adjustment and closed-loop control, with stable and accurate speed. A pressure-assist device is provided at the inlet end to avoid slipping when the PCB enters. The forced natural cooling system can meet the cooling slope requirements of the lead-free process. The track angle is manually adjusted for easy operation. The flux nozzle is driven by a stepper motor to ensure uniform flux coating. With the modular design of the spray system, the nozzle is always vertically tracked to ensure good penetration of the PCB. The preheating zone uses hot air heating; the whole process is at high temperature, with glass protection and temperature stability. The preheating system is controlled by PID, and the temperature curve is stable, which is convenient for finding the best setting for various lead-free processes
Brief:Appearance: streamlined design, internal modular design, suitable for SMT and straight-element lead-free welding. The spray system uses a centrifugal fan to prevent the flux from dripping onto the PCB. External flux buffer tank sensor, more reliable and durable. Standard cold air knife to prevent flux fog from spreading outward, reducing pollution. Double-wave control adopts the infinite frequency conversion technology, which can control the wave peak height independently. 1 / 4HP high power peak motor, maximum peak height up to 15mm. With overtemperature sound and light alarms and an emergency braking system, all motors have overload protection. The transportation system adopts infinite electronic adjustment and closed-loop control, with stable and accurate speed. A pressure-assist device is provided at the inlet end to avoid slipping when the PCB enters. The forced natural cooling system can meet the cooling slope requirements of the lead-free process. The track angle is manually adjusted for easy operation. The flux nozzle is driven by a stepper motor to ensure uniform flux coating. With the modular design of the spray system, the nozzle is always vertically tracked to ensure good penetration of the PCB. The preheating zone uses hot air heating; the whole process is at high temperature, with glass protection and temperature stability. The preheating system is controlled by PID, and the temperature curve is stable, which is convenient for finding the best setting for various lead-free processes
Brief:PCB board adjustable width: Max. 50- 200 mm PCB board transport height: 750±50 mm PCB board transport speed：0-2.0M／Min PCB board transport angle (welding angle): 3-7
Brief:SMT ovens are core equipment in surface mount technology, with key features including precise temperature control, efficient production, and process adaptability: Core Features Precise Temperature Control System Utilises an intelligent PID control system or microcomputer temperature controller, achieving temperature control accuracy of ±2°C to ensure uniform and stable temperatures inside the oven and prevent local overheating that could damage components. The preheating zone to the reflow zone employs multi-zone independent temperature control (typically 4–10 zones), supporting stepwise temperature ramp-up curves to meet the thermal sensitivity requirements of different PCB materials and components. Infrared heating technology combined with a hot air circulation system ensures an internal temperature difference of ≤5℃, eliminating soldering defects caused by the ‘shadow effect.’ Efficient production and automation Integrated automated conveyor chain (±10 mm/min precision) supports online connection with pick-and-place machines, enabling continuous production. Rapid heating design (reaches operating temperature in 10-15 minutes) reduces power consumption by 30%-40% compared to traditional equipment. Equipped with SPI online detection functionality, real-time adjustment of process parameters achieves a yield rate of over 99.8%.
Brief:PCB Curing Ovens with Instrument Panel are primarily used for automated soldering of through-hole components to circuit boards. Their core functions and technical advantages are as follows: Core Functions High-efficiency batch soldering By immersing the entire PCB board with through-hole components into molten tin (250–280°C), all through-hole solder joints are completed in a single process, significantly improving production efficiency. This is particularly suitable for through-hole processes and SMT red glue surface soldering. Ensuring Solder Joint Reliability Precise control of immersion depth (1/2–2/3 of PCB thickness) and angle (5–10°) ensures full solder filling of through-holes, achieving 100% solder penetration and eliminating missed or incomplete solder joints. Solder joints are full and smooth, with high mechanical strength and excellent vibration and crack resistance, meeting the demands of high-reliability fields such as medical and automotive electronics. Compatible with complex PCB designs Suitable for single/double-sided, multi-layer high-density circuit boards, with unique advantages for densely laid-out or large pad through-hole components (such as transformers and connectors).
