Brief:PCB Curing Ovens with Instrument Panel are primarily used for automated soldering of through-hole components to circuit boards. Their core functions and technical advantages are as follows: Core Functions High-efficiency batch soldering By immersing the entire PCB board with through-hole components into molten tin (250–280°C), all through-hole solder joints are completed in a single process, significantly improving production efficiency. This is particularly suitable for through-hole processes and SMT red glue surface soldering. Ensuring Solder Joint Reliability Precise control of immersion depth (1/2–2/3 of PCB thickness) and angle (5–10°) ensures full solder filling of through-holes, achieving 100% solder penetration and eliminating missed or incomplete solder joints. Solder joints are full and smooth, with high mechanical strength and excellent vibration and crack resistance, meeting the demands of high-reliability fields such as medical and automotive electronics. Compatible with complex PCB designs Suitable for single/double-sided, multi-layer high-density circuit boards, with unique advantages for densely laid-out or large pad through-hole components (such as transformers and connectors).
Brief:DIP Plug-in Production Line play the following key roles in electronic manufacturing: Adapting to special components Suitable for high-power devices, high-frequency components, and irregular connectors that are not suitable for surface mount technology (SMT). The plug-in process involves soldering pins through PCB holes to ensure the stable installation and heat dissipation requirements of large components (such as relays and transformers). Enhancing structural reliability Through-hole soldering creates a mechanical interlock between the pins and the PCB, achieving a vibration test pass rate of 99.2% and a 40% increase in temperature cycle lifespan, far exceeding the strength of SMT solder joints. This makes DIP technology indispensable in high-reliability fields such as military and automotive electronics. Complementary SMT Process In dual-sided mixed-assembly boards, DIP handles high-power components on the back side (such as power interfaces), while SMT manages precision ICs on the front side, saving over 15% in layout space. The two processes collaborate to achieve full-process manufacturing of complex products. Standardised production process Includes four key stages: Component pre-processing: Trimming leads and establishing a polarity database; Manual insertion: Anti-static operations + dual-person mutual inspection to reduce misinsertion rates; Wave soldering control: Precise regulation of solder bath temperature at 245±3°C; Post-processing: Automatic lead trimming and three-proof coating process.
Brief:The DIP Wave Solder In-feed Conveyor (also known as the automatic feed transfer station) is a key front-end device in the wave soldering production line. Its primary functions include precise positioning, buffering storage, and automated transfer of PCB boards, ensuring the continuity and stability of the soldering process. Automated Positioning and Transfer Through precise rail adjustment (compatible with widths typically ranging from 50 to 350 mm), it precisely aligns with preceding processes (such as the insertion line), feeding PCBs into the preheating zone at a pre-set angle (typically 5° to 7°), thereby avoiding shifts or collisions caused by manual board placement.
Brief:The SHENGDIAN 3M hot air SMT curing oven is designed for PCB processing in SMT production environments. It features PID temperature control, ±2°C temperature control accuracy, chain-driven PCB transport, synchronized guide rails, and independent temperature sensors for real-time monitoring and compensation. A temperature fault alarm system and double-cylinder furnace lifting mechanism support safer, more controlled operation.
Brief: The SHENGDIAN 12-zone nitrogen reflow oven is designed for SMT PCB soldering applications that require stable heating and repeatable thermal profiles. It features an imported heating wire assembly, dual precision inverters for hot air speed control, and a turbocharged three-layer air circulation system. These features support efficient heat transfer and consistent soldering performance, including lead-free SMT processes.
