Brief:DIP Offline Selective Soldering Machine achieves a breakthrough in core technology through precise localised soldering techniques in electronic manufacturing. Its primary applications are as follows: Resolving soldering challenges in high-density mixed-assembly boards Avoiding thermal damage to surface-mount components Traditional wave soldering requires the entire board to be immersed in tin, and high temperatures can cause surrounding surface-mount components (such as BGA chips) to remelt. Selective wave soldering uses a CNC nozzle (with a precision of 0.1mm) to spray dynamic tin waves only onto the pins of through-hole components, protecting the structural integrity of sensitive components. Eliminating micro-pitch bridging defects By independently adjusting parameters for each solder joint (temperature/time/solder volume), single-point soldering is achieved for pins with 0.5mm spacing, reducing bridging rates to below 0.03%, far below the industry average of 5% for traditional wave soldering.
Brief:The DIP Lifting Plug-in Line (lifting DIP production line) is an intelligent upgrade of the traditional plug-in line. Its core advantages are reflected in three dimensions: flexible production, human-machine collaboration, and process optimisation. The following is a detailed analysis: Dynamic adaptation to production needs (flexible manufacturing) Highly adjustable The track height can be precisely adjusted within the range of 0.8-1.4m (accuracy ±5mm) through the electronic control system. Application Scenarios: Adapting to operators of different heights (e.g., 155cm female workers vs. 185cm male workers), reducing lower back strain by 30% Raising the track during production of large automotive electronic boards (≥1.2m) to prevent board edge collisions Efficient handling of double-sided mixed-assembly boards The lifting mechanism enables automatic rotation of PCB boards from 0° to 90° to 180° (speed ≤ 3 seconds per cycle) Benefits: Double-sided assembly boards can be transferred without disassembly, reducing process intervals by 40%
Brief:Features: Appearance: streamlined design, internal modular design, suitable for SMT and straight-element lead-free welding. The spray system uses a centrifugal fan to prevent the flux from dripping onto the PCB. External flux buffer tank sensor, more reliable and durable. Standard cold air knife to prevent flux fog from spreading outward, reducing pollution. Double-wave control adopts infinite-frequency conversion technology, which can control the wave peak height independently.1 / 4HP high power peak motor, maximum peak height up to 15mm. With overtemperature sound and light alarms and an emergency braking system, all motors have overload protection. The transportation system adopts infinite electronic adjustment and closed-loop control, with stable and accurate speed. A pressure-assist device is provided at the inlet end to avoid slipping when the PCB enters. The forced natural cooling system can meet the cooling slope requirements of the lead-free process. The track angle is manually adjusted for easy operation. The flux nozzle is driven by a stepper motor to ensure uniform flux coating. With the modular design of the spray system, the nozzle is always vertically tracked to ensure good penetration of the PCB. The preheating zone uses hot air heating; the whole process is at high temperature, with glass protection and temperature stability. The preheating system is controlled by PID, and the temperature curve is stable, which is convenient for finding the best setting for various lead-free processes
Brief:Appearance: streamlined design, internal modular design, suitable for SMT and straight-element lead-free welding. The spray system uses a centrifugal fan to prevent the flux from dripping onto the PCB. External flux buffer tank sensor, more reliable and durable. Standard cold air knife to prevent flux fog from spreading outward, reducing pollution. Double-wave control adopts the infinite frequency conversion technology, which can control the wave peak height independently. 1 / 4HP high power peak motor, maximum peak height up to 15mm. With overtemperature sound and light alarms and an emergency braking system, all motors have overload protection. The transportation system adopts infinite electronic adjustment and closed-loop control, with stable and accurate speed. A pressure-assist device is provided at the inlet end to avoid slipping when the PCB enters. The forced natural cooling system can meet the cooling slope requirements of the lead-free process. The track angle is manually adjusted for easy operation. The flux nozzle is driven by a stepper motor to ensure uniform flux coating. With the modular design of the spray system, the nozzle is always vertically tracked to ensure good penetration of the PCB. The preheating zone uses hot air heating; the whole process is at high temperature, with glass protection and temperature stability. The preheating system is controlled by PID, and the temperature curve is stable, which is convenient for finding the best setting for various lead-free processes
Brief:PCB board adjustable width: Max. 50- 200 mm PCB board transport height: 750±50 mm PCB board transport speed：0-2.0M／Min PCB board transport angle (welding angle): 3-7
Brief:DIP Plug-in Production Line play the following key roles in electronic manufacturing: Adapting to special components Suitable for high-power devices, high-frequency components, and irregular connectors that are not suitable for surface mount technology (SMT). The plug-in process involves soldering pins through PCB holes to ensure the stable installation and heat dissipation requirements of large components (such as relays and transformers). Enhancing structural reliability Through-hole soldering creates a mechanical interlock between the pins and the PCB, achieving a vibration test pass rate of 99.2% and a 40% increase in temperature cycle lifespan, far exceeding the strength of SMT solder joints. This makes DIP technology indispensable in high-reliability fields such as military and automotive electronics. Complementary SMT Process In dual-sided mixed-assembly boards, DIP handles high-power components on the back side (such as power interfaces), while SMT manages precision ICs on the front side, saving over 15% in layout space. The two processes collaborate to achieve full-process manufacturing of complex products. Standardised production process Includes four key stages: Component pre-processing: Trimming leads and establishing a polarity database; Manual insertion: Anti-static operations + dual-person mutual inspection to reduce misinsertion rates; Wave soldering control: Precise regulation of solder bath temperature at 245±3°C; Post-processing: Automatic lead trimming and three-proof coating process.
Brief:The DIP Wave Solder In-feed Conveyor (also known as the automatic feed transfer station) is a key front-end device in the wave soldering production line. Its primary functions include precise positioning, buffering storage, and automated transfer of PCB boards, ensuring the continuity and stability of the soldering process. Automated Positioning and Transfer Through precise rail adjustment (compatible with widths typically ranging from 50 to 350 mm), it precisely aligns with preceding processes (such as the insertion line), feeding PCBs into the preheating zone at a pre-set angle (typically 5° to 7°), thereby avoiding shifts or collisions caused by manual board placement.
