Brief:The SMT Oven Furnace Temperature Tester plays a central role in temperature monitoring and process optimisation in electronic manufacturing. Its specific functions and technical value are as follows: Real-time, accurate temperature monitoring Dynamic temperature curve recording Synchronised with the PCB board as it enters the reflow oven, it uses multiple thermocouples (typically 6-32 channels) to record temperature changes in each temperature zone in real time, with a measurement accuracy of ±0.3°C. Captures data throughout the entire process from preheating → constant temperature → reflow → cooling, preventing defects such as cold solder joints and voids caused by temperature fluctuations. Temperature deviation anomaly warning Automatically triggers an alarm when temperature deviates from the set threshold (e.g., ±5°C), preventing batch scrap caused by uncontrolled furnace temperature. Process parameter optimisation Analyses temperature curve data, automatically calculates slope, peak temperature, and time window (e.g., duration maintained above 217°C), guiding engineers in adjusting chain speed and temperature zone settings.
Brief:The steel mesh inspection machine (also known as steel mesh detection equipment) is a core device used in electronic manufacturing to control the quality of SMT steel mesh. Its core function is to prevent solder paste printing defects at the source through high-precision optical detection technology, thereby improving the yield rate of SMT production lines. The following are its specific functions and values: Core Functions Steel mesh aperture quality inspection Precise measurement of aperture dimensions, positional offset, and area error (with accuracy down to the micrometre level), identifying defects such as multiple apertures, missing apertures, foreign object blockages, and burrs, ensuring precise and accurate solder paste deposition. Supports tension testing (e.g., steel mesh relaxation), preventing printing deformation caused by insufficient tension.
Brief:SMT Offline AOI Inspection Equipment (Automatic Optical Inspection) is an optical inspection system independent of the production line, primarily used for in-depth analysis of printed circuit board (PCB) assembly quality and process optimisation in electronic manufacturing. Its core functions and advantages are as follows: Core Functions In-depth defect detection Performs high-precision full inspection on PCBs that have been completed with component placement or soldering, identifying defects such as misplaced components, missing components, reversed polarity, misalignment, and tombstoning in component placement, as well as defects like cold solder joints, bridging, insufficient solder, and solder balls in soldering. Supports 3D scanning technology to precisely measure solder joint height and morphology, detecting hidden solder joint issues in BGA, QFN, and other components. Process Data-Driven Optimisation Analyses inspection data using SPC (Statistical Process Control) to generate defect distribution maps, first-pass yield trends, and other reports, providing a basis for adjusting placement parameters, solder paste printing pressure, and other processes. Case Study: A company reduced solder joint bridging defect rates from 0.8% to 0.03% through offline AOI data analysis. Flexible Adaptation to Multiple Scenarios Compatible with both sampling and full inspection: Can perform full inspection for small-batch, high-reliability products (e.g., medical, automotive electronics) or sampling quality inspection for large-batch products. Non-real-time intervention: Operates independently of the production line, with the inspection process not affecting the mainline cycle time, making it suitable for in-depth analysis of complex boards with high repair difficulty.
Brief:First Article Inspection Machine with Scanning Function 1. Efficient Operation and Cost Savings Efficient single-person operation: Only one person is needed to complete the inspection task (traditional methods require 2-3 people to collaborate), significantly reducing labour costs. Significant increase in inspection speed: Through intelligent navigation and automatic data collection, inspection time is reduced by 50%-80%, effectively shortening the production line waiting cycle. 2. Intelligent Inspection and Error-Proofing Mechanism Automatic Program Generation: After importing the BOM file, CAD coordinates, and PCB scan images, the system automatically generates the inspection path without manual programming (taking only 2-5 minutes). Dynamic Navigation Assistance: Real-time highlighting of the positions of components to be tested, with support for image zoom and rotation, to prevent manual positioning errors. Prevention of missed inspections and misjudgments: Automatically identifies untested components, combines LCR tester automatic readings with standard values, and instantly determines results (PASS/NG), eliminating human error. III. High-Precision Inspection and Data Management Precise measurement tools: Uses a high-precision LCR bridge instead of a multimeter, automatically adjusts the range, and ensures accurate measurement of electrical parameters of components such as resistors, capacitors, and inductors. Optical Automatic Comparison: Visually identifies components with silk screen markings, such as ICs and diodes, and automatically detects defects such as incorrect orientation and misalignment. Traceability Assurance: Automatically records and stores test data, generates Excel reports containing timestamps and measurement values, supports scenario reconstruction and database archiving, and meets ISO quality traceability requirements.
Brief:First Article Inspection Machine has the following core features and technical advantages: Intelligent testing process Automatic generation of testing procedures By integrating BOM files, CAD coordinates, and PCB drawings, the system automatically synthesises testing paths without the need for manual programming, greatly reducing preparation time (approximately 2-5 minutes). Dynamic Navigation and Automatic Judgment During testing, the system highlights the positions of components to be tested, supports image zoom, pan, and rotate functions, and assists in determining component orientation. LCR test data is automatically read and matched with component standard values, with instant results (PASS/NG) to avoid human misjudgment.
