Brief:The nozzle cleaning machine is a core auxiliary device in SMT assembly production lines, specifically designed to clean solder paste, flux, and other contaminants accumulated on the surface and interior of pick-and-place machine nozzles. Its primary functions include ensuring placement accuracy, reducing material waste, and enhancing production efficiency. Its functional value and technical implementation are as follows: Removing blockages to ensure stable adhesion Using high-pressure water mist (0.4–0.5 MPa) or ultrasonic cavitation effects (>40 kHz), the machine deeply cleans the inner walls of the nozzle (with pore sizes as small as 0.2 mm), completely breaking down solidified solder paste and adhesive residues. This prevents vacuum suction force reduction caused by blockages, thereby reducing the pick-and-place machine's scrap rate (by up to 30–50%). Extend nozzle service life Non-destructive cleaning technology (non-contact spraying) protects the nozzle surface coating and reflective plate structure, preventing physical damage caused by traditional steel needle scrubbing or ultrasonic cleaning, extending nozzle service life to over 3,000 cycles and reducing spare part procurement costs. Improve placement accuracy and yield rate Ensure the nozzle hole walls are smooth and residue-free, maintaining stable component pickup accuracy (especially for micro-components such as 0201 chips and Mini LEDs), reducing defects such as placement offset and tombstoning, and lowering SMT soldering defect rates by 35%–40%.
Brief:The Screen Stencil Cleaning Machine is a critical piece of equipment in SMT (Surface Mount Technology) production lines, specifically designed to remove residues such as solder paste and red glue from the surface of steel meshes, ensuring printing accuracy and production continuity. Its core functions and technical implementation are as follows: Removing residues to prevent blockages Efficiently removes solidified solder paste particles (including solder powder and flux) and red glue residues from the mesh openings of the steel mesh, preventing blockages that cause printing misalignment and uneven solder paste distribution. This reduces焊接 defects such as cold solder joints and bridging from the source. Example: When printing with an uncleaned steel mesh, blockages in the mesh openings reduce solder paste transfer by 30%, leading to component detachment. Extend steel mesh lifespan Flux in solder paste corrodes the steel mesh surface. Regular deep cleaning can extend the steel mesh lifespan to 3,000 uses or more (uncleaned steel mesh lifespan is reduced by 30%–50%). Improve printing quality and yield rate Ensuring no residue on the mesh edges allows solder paste to transfer to PCB pads in precise shapes/volumes, reducing SMT welding defect rates by 35%–40%.
Brief:A PCB Board Dust Cleaning Machine is an automated device specifically designed for removing dust, debris, and static electricity during the manufacturing process of printed circuit boards (PCBs). Its core function is to ensure product quality, improve yield rates, and maintain production safety. Core Dust Removal Functions Removal of Processing Dust and Debris Removes metal dust and resin debris (particle size ≤5μm) generated during PCB drilling and cutting, preventing blockage of micro-holes or adhesion to pads that could cause cold solder joints or short circuits, ensuring circuit conductivity. Eliminating Electrostatic Interference Integrated ion wind bars or anti-static brushes neutralise static charges accumulated on the PCB surface (surface resistance reduced to 10⁶–10⁹Ω), preventing static attraction of dust or breakdown of precision components (such as IC chips). Ensure cleanliness Remove foreign objects such as fibres, hair, and skin particles adhering to the PCB surface to meet cleanliness standards prior to optical inspection (e.g., no visible contaminants on pads).
