Brief:YAMAHA Pick and Place Machine core approach to improving production efficiency combines automation technology with process optimisation strategies to achieve breakthroughs in production capacity: High-precision motion system Magnetic levitation linear motors and roller belt drive mechanisms are used to achieve positioning accuracy of ±0.025 mm, reducing rework caused by component placement misalignment. Direct-drive rotary placement head design increases placement speed for 0201 micro-components (0.4×0.2mm) by 5% Intelligent Feeding Optimisation Large-capacity reel feeders: 13-inch reels replace 7-inch reels, reducing changeover frequency by 25% and minimising downtime SL feeder (Super Loading Feeder): Supports automatic material pickup, enabling continuous, uninterrupted feeding
Brief:A pick-and-place machine is the core equipment for achieving automatic component placement in electronic manufacturing, with its primary functions as follows: 1. Achieving high-precision component placement Micron-level positioning accuracy Through visual systems (such as high-resolution cameras) and precision motion control mechanisms (such as magnetic levitation linear motors), placement accuracy can reach ±0.025mm, meeting the placement requirements for 01005 micro-components (0.4×0.2mm). For example, flip-chip placement machines can achieve 0.5-micron packaging accuracy, suitable for precision fields such as µLED and MEMS. Intelligent recognition and correction Utilising machine learning algorithms to identify component position deviations, automatically compensating for PCB expansion/contraction errors, achieving 99.8% placement repeatability, and eliminating human operational errors. II. Enhancing Production Efficiency and Flexibility High-Speed Placement Capability The fully automatic model achieves a placement speed of 23,500 CHIP/H (chip components per hour). The turret structure enables simultaneous pick-and-place operations through 180° rotation, improving efficiency by 40%. Multi-component compatibility Adaptive nozzles: Vacuum nozzles accommodate packages from 0201 to 55mm high-power modules, with pneumatic grippers available for irregularly shaped components. Feeding system: Supports multiple feeding types including tape, tube, and tray, with a single line capable of managing over 1,000 material types. III. Ensuring Product Quality and Reliability Soldering Yield Optimisation Precise control of placement pressure (adjustable from 0.1N to 400N) and angle reduces cold solder joints/misalignment, improving BGA chip pin alignment accuracy by 40% and reducing solder joint defect rates to below 0.02%. Interference-resistant design Short-lead or leadless packaging reduces parasitic inductance, enhancing high-frequency circuit performance and supporting signal transmission above 3GHz, suitable for 5G device manufacturing.
