Lead-free Wave Soldering Machine

Lead-free Wave Soldering Machine is a widely used soldering technique in electronics manufacturing, especially for surface mount technology (SMT) PCB board soldering. This technology uses molten liquid lead-free solder to form a specific shape of solder wave on the liquid surface of the solder bath, through a certain angle and immersion depth, so that the PCB board with inserted components passes through the solder wave to achieve the process of soldering joints.

The working principle of Lead-free Wave Soldering Machine involves the formation of the solder wave, the passage of the PCB board and the formation of the solder joint. Firstly, molten liquid lead-free solder is pumped by a power pump to form a specific shape of solder wave on the liquid surface of the solder bath. Then, the PCB board with inserted components passes through the solder wave at an angle via a conveyor belt. During the wave soldering process, the PCB comes into contact with the leading surface of the solder wave, the oxide ruptures, and the solder wave pushes the PCB forward. Throughout the process, the substrate and pins are heated, and before leaving the wave surface, the entire PCB board is immersed in the solder and bridged by the solder. The moment it leaves the end of the wave, a small amount of solder adheres to the pad due to the wetting force, and will shrink to a minimum due to surface tension, forming a full, rounded solder joint.