SD-630 BGA Rework Station: Precision, Automation, and Reliability for Premium Soldering Solutions
In the fast-paced world of electronic manufacturing, precision, efficiency, and reliability are non-negotiable. Whether you’re tackling lead-free processes, POP packaging rework, or high-precision PCB assembly, the SD-630 BGA Rework Station from Shenzhen Shengdian Electronic Equipment Co., Ltd. stands out as a game-changer. Engineered with cutting-edge technology and user-centric design, this rework station redefines industry standards, ensuring flawless soldering results while maximizing productivity.
Unmatched Automation & Intelligent Operation
The SD-630 integrates a revolutionary all-in-one design for the upper heating head and placement head, enabling automatic soldering, automatic removal, and automatic placement in one seamless workflow. Say goodbye to manual errors and inconsistent results—its high level of automation eliminates human intervention, making it ideal for complex rework tasks like lead-free processes and POP packaging.
Equipped with a large-color touchscreen HMI and PLC control system, operating the SD-630 is intuitive and efficient. The interface displays six real-time temperature curves, allowing you to monitor and adjust parameters with precision. With 8-stage temperature control and the ability to store 1-100 sets of temperature curve presets, you can easily switch between different workflows and analyze curves directly on the touchscreen—saving time and ensuring process consistency.
Precision Temperature Control & Multi-Zone Heating
At the core of the SD-630’s performance is its advanced temperature control system. Adopting high-precision K-type thermocouple closed-loop control, it maintains temperature accuracy within ±1℃, a critical factor for protecting sensitive electronic components and achieving perfect solder joints. Three external temperature measurement interfaces provide real-time precision detection, leaving no room for temperature deviations.
The rework station features three independent upper and lower heating zones, each optimized for specific tasks:
Zones 1 and 2 support multi-group, multi-stage temperature control simultaneously, adapting to diverse PCB and component requirements.
Zone 3 delivers large-area preheating for PCBs, ensuring uniform heat distribution and preventing thermal stress—eliminating issues like solder joint cracks or component damage.
A unique liftable PCB support design in Zone 2 prevents PCB collapse during welding, further enhancing rework quality. After soldering, a high-power cross-flow fan rapidly cools the PCB, avoiding deformation and preserving the integrity of your workpieces.
Superior Positioning Accuracy & Component Protection
Precision is non-negotiable in BGA rework, and the SD-630 delivers with a high-precision optical visual alignment system. Equipped with a 15-inch color LCD monitor, the system offers zoom and auto-focus functions, ensuring alignment accuracy within 0.01-0.02mm. The V-shaped slot positioning and movable universal fixture provide flexible and secure PCB fixing, protecting delicate PCBs from scratches or damage while allowing X/Y direction adjustments for perfect alignment every time.
Safety is a top priority: the SD-630 is fitted with high-sensitivity photoelectric switches that prevent the heating head from crushing the PCB motherboard during operation. Dual over-temperature protection mechanisms—automatic power cutoff and audible alarms—activate immediately if temperatures exceed safe limits, safeguarding both the equipment and your valuable components.
Robust Construction & Versatile Compatibility
Built for industrial durability, the SD-630 features premium electrical components, including a Panasonic motion control system and high-precision intelligent temperature control modules, ensuring long-term stable operation even in demanding production environments. Its compact yet sturdy design (770×750×770mm) fits seamlessly into any workshop, while a net weight of 66KG (86KG packed) ensures stability during operation.
The SD-630 supports a wide range of PCB sizes, from 10×10mm to 470×430mm, making it versatile enough for small components and large PCBs alike. Powered by AC220V-10% 50/60HZ, it adapts to global power standards, making it a reliable choice for manufacturers worldwide.
Why Choose the SD-630 BGA Rework Station?
Unrivaled Precision: ±1℃ temperature accuracy and 0.01-0.02mm alignment precision for flawless results.
Intelligent Automation: Automatic soldering/removal/placement and preset temperature curves for efficient, consistent workflows.
Versatile Performance: Ideal for lead-free processes, POP packaging, and a wide range of PCB sizes.
Reliable Durability: Premium components and robust construction for long-term industrial use.
Elevate your electronic manufacturing and rework capabilities with the SD-630 BGA Rework Station—where precision meets efficiency, and reliability meets innovation. Trust Shenzhen Shengdian Electronic Equipment Co., Ltd. to deliver the tools you need to stay ahead in the competitive electronics industry.
Contact us today to learn more about the SD-630 and how it can transform your production line!
Technical Specifications
No.
Description
Details
1
Total Power
5500W
2
Overall Dimensions
770 (L) × 750 (W) × 770 (H) mm
3
Lower Heating Power
1200W
4
Infrared Preheating Zone Power
2700W
5
Upper Heating Power
1200W
6
Electrical Components
Panasonic motion control system + large-color touchscreen + high-precision intelligent temperature control module
