In today's era of rapid iteration in the electronic manufacturing and repair industry, unprecedentedly stringent requirements have been imposed on the precision, efficiency, and safety of BGA chip soldering. Shenzhen Shengdian Electronic Equipment Co., Ltd., deeply engaged in the core technologies of the industry, has meticulously crafted the SD-560 BGA Rework Station — a flagship device integrating intelligent technology, humanized design, and industrial-grade performance. It brings a disruptive precision soldering solution to electronic engineers, repair technicians, and enterprise production workshops worldwide, turning every rework into a flawless technological feast.
The core advantage of the SD-560 BGA Rework Station stems from its relentless pursuit of technological innovation. The independently developed upper and lower independent heating air volume adjustment system breaks the "one-size-fits-all" heating dilemma of traditional equipment. Whether it is a microchip or a large component, precise air volume adaptation ensures uniform heat penetration during soldering, resulting in full and firm solder joints, fundamentally eliminating industry pain points such as cold solder joints and desoldering. It is also equipped with an exclusive infrared positioning function, like installing "smart eyes" for chip soldering, which quickly locks the core area of the BGA chip with positioning accuracy comparable to professional surveying and mapping instruments, making complex alignment operations easy and efficient.
In terms of operational experience, the SD-560 achieves the perfect balance between "foolproof intelligence" and "professional depth". The independently developed human-machine interface, based on a large-screen true-color touch screen, presents all functions intuitively at a glance. The innovative one-click curve generation function simplifies complex temperature parameter settings to a light touch of the finger. The optimal soldering curve can be generated without tedious debugging, allowing even novices to get started quickly, while professional technicians can save a lot of time and cost. At the same time, the device supports 9-stage independent temperature control for the upper and lower heaters and the bottom heater. Three real-time temperature curves are dynamically displayed synchronously on the screen. Combined with high-precision K-type thermocouple closed-loop control and an external temperature measurement interface, it achieves a theoretical temperature control accuracy of ±0.1℃ (actually controlled within ±3℃ in use, affected by the environment), making the entire temperature change process visualizable and traceable, and accurately controlling every soldering node.
In the details, the ingenuity of industrial design is fully reflected. The 360° rotatable hot air nozzle flexibly adapts to soldering needs at different angles, covering the working area without dead ends. The bottom infrared heating plate adopts full-area uniform heat dissipation technology, ensuring that the temperature difference on the PCB board surface is close to zero, effectively protecting the circuit board from local high-temperature damage. The PCB board positioning system innovatively integrates infrared positioning and V-shaped groove design, combined with a movable universal pin-type fixture. It can firmly fix PCB boards of different sizes (20×20mm to 420×500mm) while minimizing the pressure of the fixture on the board body, achieving non-destructive positioning. The high-power cross-flow fan provides lightning-fast cooling speed, quickly lowering the temperature after soldering, greatly shortening the operation cycle and improving overall work efficiency. It is also thoughtfully equipped with dual reminder functions: post-soldering completion alarm and advance alarm, allowing operators to avoid constant monitoring, balance multi-task processing, and prevent operational omissions.
As an industrial-grade device, the SD-560's high-performance configuration is a benchmark in the industry. The total power of 5.2KW provides strong power support. The optimal power ratio of 1.2KW for the upper and lower hot air heaters and 2.7KW for the bottom infrared heater ensures stable and long-lasting heat output. The powerful combination of PLC programmable controller and high-precision intelligent temperature control module endows the device with excellent operational stability and anti-interference ability, adapting to long-term and high-intensity industrial production environments. The whole machine adopts a sophisticated and atmospheric black appearance design. With a compact size of 680mm×560mm (660mm including bracket and handle) ×530mm, it saves workshop space. At the same time, the weight of 38KG (packing weight 58KG) balances mobility and placement stability, easily adapting to both large-scale production workshops and small-scale repair studios.
From consumer electronics repair to industrial circuit board processing, from laboratory research and development to large-scale production, the SD-560 BGA Rework Station has become the trusted choice for precision electronic soldering in various industries with its all-round advantages. It is not only a rework device but also a core competitiveness to improve production efficiency, reduce repair costs, and ensure product quality. Shenzhen Shengdian Electronic Equipment Co., Ltd. has always adhered to the concept of "technological innovation and quality first", providing global customers with professional electronic equipment solutions through strict production standards and perfect after-sales service.
Choosing the SD-560 BGA Rework Station means choosing precision, efficiency, and peace of mind, allowing every soldering to demonstrate the power of technology and every product to carry the temperature of craftsmanship. Get yours now to embark on a new era of precision electronic repair!
