The core features of the compact rework station are primarily reflected in its compactness, flexibility, and specialised functionality, as detailed below: 1. Compact Structural Design Compact Chassis Specifically designed for scenarios with limited repair space, the typical dimensions are compatible with PCB boards ranging from 11×7 cm to 13×13 cm (e.g., RBN/RBSM series), with a desktop footprint reduced by 60% compared to standard models. Ergonomic stand Supports vertical lifting and horizontal micro-adjustment, allowing operators to adjust the repair angle with one hand. Modular integration Integrated design of the hot air nozzle and placement head eliminates the need for external equipment, enabling ‘pick-place-solder’ single-machine operation. 2. Precise temperature control capability Efficient heating system The upper hot air nozzle achieves a heating rate of 10°C/second, combined with an infrared lower heating zone, to rapidly reach lead-free soldering temperature curves (≥217°C); Three-zone independent control models can preheat the entire PCB, eliminating the risk of thin board deformation (warpage reduced by 70%). Intelligent temperature control algorithm PID closed-loop regulation ensures uniform melting of solder joints, preventing chip overheating damage, and is compatible with 0.3mm micro-pitch BGA rework.
