Core Features and Advantages of the SMT Solder Paste Reverse Temperature Machine

Core Features and Advantages of the SMT Solder Paste Reverse Temperature Machine

Precise Temperature Control and Stepwise Heating

Employing PID algorithm control for the heating plate, the heating rate is strictly limited to 1-2°C per minute. This prevents thermal stress issues in the solder paste caused by abrupt temperature changes, ensuring uniform internal and external temperatures.

The low-temperature zone (10-15°C) melts surface ice crystals before gradually transitioning to the ambient zone (20-25°C), preventing solder ball defects caused by powder agglomeration and moisture vaporisation.

‌Intelligent Agitation Technology‌

The planetary stirring system (360° rotation + 15° revolution) thoroughly blends tin powder with flux, enhancing via fill rate by 15% and producing a more uniform intermetallic compound (IMC) layer post-soldering.

This resolves uneven flux distribution caused by traditional natural settling, reducing the risk of cold solder joints.

‌Efficiency and Automation‌

Dynamic power adjustment technology reduces re-flow time from 4 hours to 30 minutes. Supports remote monitoring via IoT modules and integrates with MES system data.

The 8-station design (compatible with solder paste/red glue) features timers for independent control of re-flow duration and alarm notifications, enhancing production line coordination efficiency.

‌Safety and Stability‌

Eliminates burn and fire hazards associated with manual reheating. Features an integrated emergency stop switch and transparent viewing window for real-time operational monitoring.

Intelligent temperature control prevents oxidation or volatilisation from excessive reheating, safeguarding solder paste activity and soldering quality.

Typical Application Scenarios

High-density PCB production: Ensures solder paste flowability and flux activity prior to soldering precision components like BGAs and QFNs.

Multi-variety, small-batch production lines: Enables rapid switching between solder paste types (e.g., lead-free/lead-containing), minimising downtime.