Hot Air Reflow Soldering Oven

SMT Hot Air Reflow Soldering Oven Overview

SMT hot air reflow soldering is a common electronic assembly process, which completes the component soldering process by placing the printed board into a heated device. This soldering method is widely used in the electronics industry, especially in the field of SMT (Surface Mount Technology).

Types of Hot Air Reflow Soldering Oven

Current reflow soldering equipment can be divided into two main categories: large-circulation hot air reflow soldering and micro-circulation hot air reflow soldering. These two types of equipment are used in the way of forced convection, in which the wind wheel rotates at high speed, from the electric heat pipe to take away the heat, the role of the PCB board. Cold air is sucked back from the centre of the wind wheel to form a reciprocating cycle, accelerating the process of heat exchange between the cold air and hot air, thus ensuring the temperature uniformity within the flow area. In a large number of over the board, the heat taken away by the PCB board can be made up in time from the electric heat pipe. As the temperature control in the PID system, which will minimise the temperature overshoot, so that the temperature stability of the temperature zone is greatly improved. Large Cycle Hot Air Reflow Soldering Oven is a single side of the PCB is heated, the PCB deformation has a greater impact on the temperature compensation time is relatively long; and micro-circulation hot air reflow soldering is a double-sided PCB is heated, the PCB can be more uniform heat, temperature zone temperature is more stable, which greatly improves the quality of welding.

Hot Air Reflow Soldering Technology Characteristics

The overall structure of the Hot Air Reflow Soldering Oven mainly includes five main parts: heating zones, cooling zones, gas circulation device in the oven, exhaust gas discharge device and PCB transmission. The temperature control of each heating zone is an independent closed-loop control system, through the PID control to keep the temperature at the set value. Hot air reflow soldering has the characteristics of uniform heating and stable temperature, but because the temperature difference between the top and bottom of the PCB and the temperature gradient along the length of the oven is not easy to control, it is generally not used alone.

Advantages of SMT Hot Air Reflow Soldering Oven

Hot air reflow soldering as a welding technology, its advantages are mainly reflected in the following aspects:

Temperature Control: hot air reflow soldering in the temperature control using advanced PID system, can effectively reduce the temperature overshoot, mention the temperature stability of the high temperature zone.

Uniform Heating: through the PCB board for forced convection heating, can ensure that the temperature uniformity within the flow area.

Reduce Oxidation: in the welding process, hot air reflow soldering can control the gas environment, reduce the occurrence of oxidation.