Home » News » Operating Procedures And Methods for Reflow Soldering Equipment

Operating Procedures And Methods for Reflow Soldering Equipment

Views: 0     Author: SHENGDIAN     Publish Time: 2025-07-21      Origin: Site

Inquire

facebook sharing button
twitter sharing button
line sharing button
wechat sharing button
linkedin sharing button
pinterest sharing button
whatsapp sharing button
kakao sharing button
snapchat sharing button
sharethis sharing button

Operating Procedures and Methods for Reflow Soldering Equipment

The operating procedures and methods for reflow soldering equipment primarily include the following steps:

1. Pre-Operation Preparation

‌Equipment Inspection‌

Clean the interior of the equipment to ensure no debris remains.

Check if the emergency stop switch is reset and if the power cord connections are secure.

Adjust the track width to match the PCB board dimensions.


Parameter Preset

Select the preset temperature curve based on welding requirements (e.g., preheating zone, holding zone, reflow zone, cooling zone):

Preheating Zone: 60–130°C to prevent thermal shock damage to components.

Holding Zone: 120–160°C to evaporate flux moisture.

Rework Zone: 220-250°C, to melt the solder paste and form solder joints.

Cooling Zone: Rapidly cool and solidify the solder joints.

Independently adjust the target temperature of each temperature zone and the conveyor belt speed.

II. Soldering Process

PCB Board Pre-Treatment

Evenly apply solder paste to the pads to avoid uneven heating.

Precisely install components using a pick-and-place machine.

Start Soldering

Power on the machine, select a preset curve or custom parameters.

Once all temperature zones reach the set temperature (green light turns on), place the PCB on the conveyor belt.

Ensure the PCB is fed continuously, in the correct direction, and with appropriate spacing.


‌Reflow Soldering Mode Operation‌

‌Heating Zone‌: Rapidly heat up to the preset value; the higher the power, the faster the heating rate.‌

‌Temperature Maintenance Zone‌: The temperature approaches the soldering point, and the solder paste begins to melt.‌

‌Soldering Zone‌: Maintain a constant temperature to solidify the solder joints (e.g., 230°C for 120 seconds).‌

‌Cooling Zone‌: Automatically cool down to a safe temperature.


3. Precautions

‌Temperature calibration‌: Use a temperature sensor to measure the temperature zone data and fine-tune the parameters.

‌Double-sided board welding‌: Complete one side of the welding first, then cool it before proceeding to the other side.

‌Safety precautions‌: Wait until the temperature has dropped to room temperature before removing the board to avoid burns.

‌Equipment maintenance‌: Regularly disconnect the power supply for inspection to ensure that the fan and conveyor belt are operating normally.


Telephone

+86-135-5475-8169
​Copyright © 2024 SHENGDIAN ELECTRONICS. All Rights Reserved.
Technology by leadong.com

Support

About

Subscribe to our newsletter

Promotions, new products and sales. Directly to your inbox.