The Screen Stencil Cleaning Machine is a critical piece of equipment in SMT (Surface Mount Technology) production lines, specifically designed to remove residues such as solder paste and red glue from the surface of steel meshes, ensuring printing accuracy and production continuity. Its core functions and technical implementation are as follows: Removing residues to prevent blockages Efficiently removes solidified solder paste particles (including solder powder and flux) and red glue residues from the mesh openings of the steel mesh, preventing blockages that cause printing misalignment and uneven solder paste distribution. This reduces焊接 defects such as cold solder joints and bridging from the source. Example: When printing with an uncleaned steel mesh, blockages in the mesh openings reduce solder paste transfer by 30%, leading to component detachment. Extend steel mesh lifespan Flux in solder paste corrodes the steel mesh surface. Regular deep cleaning can extend the steel mesh lifespan to 3,000 uses or more (uncleaned steel mesh lifespan is reduced by 30%–50%). Improve printing quality and yield rate Ensuring no residue on the mesh edges allows solder paste to transfer to PCB pads in precise shapes/volumes, reducing SMT welding defect rates by 35%–40%.
