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SD-801
SHENGDIAN
Heating unit: Gently raises the temperature using hot air or a heating plate to avoid local overheating.
Insulation unit: Maintains a stable temperature to ensure that the solder paste is heated evenly.
Control unit: A microcomputer system sets the rewarming time to achieve automated operation.
Independent Slot Control: Each solder paste container corresponds to an independent timer, automatically popping up when the set time is reached (e.g., the HT-8 model supports simultaneous operation of 8 containers).
Safety Lock: The container cannot be removed before the rewarming time is reached or in case of power failure, preventing accidental operation.
Removal from Refrigeration: Solder paste is removed from the refrigerator and placed directly into the equipment slot.
Parameter Setting: Set the reheating time according to solder paste specifications (e.g., 500g standard can).
Automatic Reheating: The equipment heats and insulates; once the time is reached, the slot automatically unlocks.
Direct Use: Once reheating is complete, open the lid, stir, and feed into the SMT production line.
A solder paste rewarming machine is SMT auxiliary equipment designed to restore refrigerated solder paste to a suitable working temperature before use. It helps reduce temperature differences and minimize condensation risks during material preparation.
Solder paste is commonly stored under refrigerated conditions to maintain its properties. Rewarming allows the material to approach room temperature before opening, helping reduce condensation and supporting more consistent printing preparation.
Yes. The SHENGDIAN intelligent solder paste and red glue rewarming machine is designed for both materials. However, the recommended temperature and handling procedure should follow the requirements of each material manufacturer.
Solder paste may be stored at approximately 2–10°C and brought to room temperature, often around 22–28°C, before use. The actual target temperature should follow the solder paste manufacturer's technical data sheet.
No. Temperature recovery and mixing are different preparation steps. Rewarming helps restore the material temperature, while mixing follows the solder paste manufacturer's instructions to achieve the required consistency before printing.
When cold solder paste is exposed to warmer ambient air, moisture may condense on the material or container. Allowing the solder paste to reach the recommended temperature before opening helps reduce this risk.
The machine is designed as SMT auxiliary equipment for material preparation. Buyers should confirm its installation requirements, operating workflow and production capacity with SHENGDIAN before purchasing.