Basic SMT Process

Solder paste printing → Component placement → Reflow soldering → AOI optical inspection → Rework → Panel separation.

The pursuit of miniaturization in electronic products has made it impossible to further reduce the size of traditional through-hole components. Currently, integrated circuits (ICs) no longer use through-hole components, especially large-scale, highly integrated ICs, which necessitate the use of surface-mounted devices. With mass production and automation, manufacturers must produce high-quality products at low cost and high volume to meet customer demands and enhance market competitiveness. The development of electronic components, the advancement of integrated circuits, and the diverse applications of semiconductor materials make an electronic technology revolution inevitable. It is conceivable that as international CPU and GPU manufacturers like Intel and AMD refine their processes to 20 nanometers, the development of SMT (Surface Mount Technology) and its processes has become an unavoidable trend.

Advantages of SMT Processing:

• High assembly density

• Smaller and lighter electronic products

• The size and weight of surface-mounted components are only about 1/10 of traditional through-hole components

• High reliability

• Strong resistance to vibration

• Low solder joint defect rate

• After adopting SMT, the size of electronic products can be reduced by 40% to 60%, and the weight can be reduced by 60% to 80%

• Excellent high-frequency characteristics

• Reduced electromagnetic and radio frequency interference

• Easy to automate, improving production efficiency

• Cost reduction by 30% to 50%

• Savings in materials, energy, equipment, manpower, and time

Shenzhen Shengdian Electronic Equipment Co., Ltd.is a company specializing in the production of SMT equipment. We are your most reliable partner in China!