In the field of electronic manufacturing, the rework process of BGA (Ball Grid Array) components has extremely high requirements for equipment precision, automation level, and temperature control stability, which directly affect product yield and production efficiency. Shenzhen Shengdian Electronic Equipment Co., Ltd., a leader in R&D and manufacturing of electronic equipment, has launched the SD-630 BGA Rework Station to address complex rework scenarios such as lead-free processes and POP (Package on Package) packaging. With core advantages including integrated design, multi-zone precise temperature control, and high-definition optical alignment, this station provides an efficient and reliable rework solution for the industry.
1. Integrated Automated Design, Eliminating Human Errors
The SD-630 BGA Rework Station achieves a breakthrough in integrating the upper heating head and mounting head. It can complete the entire process of "automatic soldering - automatic removal - automatic mounting" without additional component switching, significantly reducing manual intervention. Equipped with a touchscreen human-machine interface and PLC control system, the equipment features clear and intuitive operation logic. Even for complex rework tasks, standardized operations can be realized through preset programs, effectively avoiding positioning deviations, inaccurate temperature control, and other issues caused by manual operations. It is particularly suitable for consistent rework needs in mass production.
2. Multi-Zone Precise Temperature Control, Laying a Solid Foundation for Soldering Quality
Temperature control is the core key to BGA rework, and the SD-630 has achieved multiple breakthroughs in its temperature control system:
Three-Dimensional Independent Temperature Zones: There are three independent heating zones (upper and lower). The first and second zones support synchronous multi-group and multi-stage temperature control, which can accurately match the heating curve according to different component materials and PCB characteristics. The third zone focuses on large-area preheating of PCB boards, avoiding board deformation caused by excessive local temperature differences, and ensuring uniform melting of solder and firm solder joints during soldering.
High-Precision Detection and Storage: Adopting high-precision K-type thermocouple closed-loop control, the temperature difference is strictly controlled within ±1℃. Equipped with 3 external temperature measurement interfaces, it captures real-time temperature changes in the heating area. The equipment can store 1-100 sets of temperature curves, supporting real-time viewing, curve trend analysis, and quick parameter modification on the touchscreen, meeting the personalized rework needs of different types of components.
3. Flexible Positioning and Protection, Balancing Efficiency and Safety
To adapt to PCBs of different sizes and specifications, the SD-630 adopts a combined solution of V-shaped slot positioning + movable universal fixture: The PCB bracket supports free adjustment in the X and Y axes, and can achieve second-level precise positioning with the laser positioning light. At the same time, the soft fixture material can effectively avoid scratches on the edge of the PCB. The second temperature zone is specially designed with a liftable support structure to prevent PCB collapse due to thermal softening during soldering, ensuring rework yield from the details.
In terms of safety protection, the equipment is equipped with a dual over-temperature protection mechanism - when over-temperature occurs, it automatically triggers an alarm and cuts off the heating power to avoid component damage caused by temperature runaway. The high-sensitivity photoelectric switch monitors the movement trajectory of the heating head in real-time, and immediately shuts down if there is an abnormal downward pressure trend, preventing damage to the PCB motherboard and providing protection for production operations.
4. High-Definition Optical Alignment, Micron-Level Precision Control
To meet the alignment needs of tiny solder joints of BGA components, the SD-630 is equipped with a high-precision optical visual alignment system, combined with a 15-inch color LCD monitor. It can realize image zooming and auto-focusing, and the alignment accuracy is stably controlled within 0.01-0.02mm. Even for POP packaging components with high-density pins, it can accurately align the solder joints, eliminating cold soldering and wrong soldering problems. After soldering, the high-power cross-flow fan cools down quickly to avoid PCB deformation caused by continuous high-temperature action, further ensuring the structural stability of the reworked products.
5. Core Parameters: High-Performance Configuration Supports Outstanding Performance
| Category | Specific Parameters |
| Power Configuration | Total Power: 5500W (Lower Heating: 1200W, Infrared Preheating Zone: 2700W, Upper Heating: 1200W) |
| Dimension Specifications | Overall Dimension: 770mm (L) × 770mm (H) × 750mm (W); PCB Size Range: Max 470×430mm, Min 10×10mm |
| Electrical System | Panasonic Motion Control System + Large-Screen True-Color Touchscreen + High-Precision Intelligent Temperature Control Module |
| Power Requirement | AC220V±10% 50/60HZ |
| Weight Information | Net Weight: Approx. 66KG; Packaged Weight: Approx. 86KG |
From automated operation to precise temperature control, from flexible positioning to safety protection, the SD-630 BGA Rework Station solves the rework problems of complex components for electronic manufacturing enterprises with comprehensive technical advantages. Whether in the fields of consumer electronics, industrial control, or automotive electronics, it can provide stable and efficient rework support, helping enterprises improve production efficiency and product quality, and gain an advantage in the fierce market competition.
