The SHENGDIAN online PCB solder paste printer is a high-precision, industrial-grade core unit designed for high-efficiency SMT (Surface Mount Technology) assembly lines. Engineered for seamless automated integration with upstream and downstream equipment—including pick-and-place machines and reflow soldering ovens—this inline printer delivers uniform solder paste deposition onto PCB pads, laying a reliable foundation for zero-defect component mounting.
Key Technical Features & Modular Design
High-Precision Stencil System: Manufactured from premium stainless steel or nickel alloy with customized laser-cut apertures. Standard stencil thickness ranging from 0.1mm to 0.15mm ensures crisp, repeatable solder brick geometry.
Optimized Squeegee Unit: Compatible with durable metal or polyurethane blades set at an ideal 45°–60° printing angle. Operates within a precise pressure range of 3–15 N/cm² and adjustable speeds of 20–80 mm/s to guarantee consistent paste filling without bridging.
Automated Conveyor Track: Built-in automatic PCB loading and unloading system designed for direct inline integration. Minimizes manual handling, significantly reduces tactical cycle time, and optimizes line throughput.
Product Specifications
| Specification Parameter | Technical Details |
| Equipment Type | Online / Inline Automated PCB Solder Paste Printer |
| Primary Application | SMT Line Solder Paste Printing & Assembly |
| Stencil Material & Thickness | Stainless Steel / Nickel Alloy; 0.1 mm – 0.15 mm (Customizable) |
| Squeegee Material & Angle | Metal / Polyurethane; 45° – 60° Angle |
| Squeegee Pressure Range | 3 – 15 N/cm² |
| Printing Speed | 20 – 80 mm/s |
| Conveyor System | Automatic Board Loading & Unloading System |
| Line Integration | Direct interface with Pick-and-Place & Reflow Systems |
| Service Options | Factory Direct OEM / ODM, Customization & Bulk Wholesale |
