The nozzle cleaning machine is a core auxiliary device in SMT assembly production lines, specifically designed to clean solder paste, flux, and other contaminants accumulated on the surface and interior of pick-and-place machine nozzles. Its primary functions include ensuring placement accuracy, reducing material waste, and enhancing production efficiency. Its functional value and technical implementation are as follows: Removing blockages to ensure stable adhesion Using high-pressure water mist (0.4–0.5 MPa) or ultrasonic cavitation effects (>40 kHz), the machine deeply cleans the inner walls of the nozzle (with pore sizes as small as 0.2 mm), completely breaking down solidified solder paste and adhesive residues. This prevents vacuum suction force reduction caused by blockages, thereby reducing the pick-and-place machine's scrap rate (by up to 30–50%). Extend nozzle service life Non-destructive cleaning technology (non-contact spraying) protects the nozzle surface coating and reflective plate structure, preventing physical damage caused by traditional steel needle scrubbing or ultrasonic cleaning, extending nozzle service life to over 3,000 cycles and reducing spare part procurement costs. Improve placement accuracy and yield rate Ensure the nozzle hole walls are smooth and residue-free, maintaining stable component pickup accuracy (especially for micro-components such as 0201 chips and Mini LEDs), reducing defects such as placement offset and tombstoning, and lowering SMT soldering defect rates by 35%–40%.
