SMT Offline AOI Inspection Equipment (Automatic Optical Inspection) is an optical inspection system independent of the production line, primarily used for in-depth analysis of printed circuit board (PCB) assembly quality and process optimisation in electronic manufacturing. Its core functions and advantages are as follows: Core Functions In-depth defect detection Performs high-precision full inspection on PCBs that have been completed with component placement or soldering, identifying defects such as misplaced components, missing components, reversed polarity, misalignment, and tombstoning in component placement, as well as defects like cold solder joints, bridging, insufficient solder, and solder balls in soldering. Supports 3D scanning technology to precisely measure solder joint height and morphology, detecting hidden solder joint issues in BGA, QFN, and other components. Process Data-Driven Optimisation Analyses inspection data using SPC (Statistical Process Control) to generate defect distribution maps, first-pass yield trends, and other reports, providing a basis for adjusting placement parameters, solder paste printing pressure, and other processes. Case Study: A company reduced solder joint bridging defect rates from 0.8% to 0.03% through offline AOI data analysis. Flexible Adaptation to Multiple Scenarios Compatible with both sampling and full inspection: Can perform full inspection for small-batch, high-reliability products (e.g., medical, automotive electronics) or sampling quality inspection for large-batch products. Non-real-time intervention: Operates independently of the production line, with the inspection process not affecting the mainline cycle time, making it suitable for in-depth analysis of complex boards with high repair difficulty.
