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Views: 0 Author: Site Editor Publish Time: 2026-07-21 Origin: Site
As the electronics repair, semiconductor recycling, and refurbishment industries continue to grow, more companies are seeking efficient ways to remove BGA chips from PCBs for reballing, testing, and reuse.
However, the success of chip recovery depends not only on the operator's experience, but more importantly on precise control of the thermal profile, uniform heat distribution, and the long-term stability of the equipment.
To meet these industry demands, Shengdian has developed a dedicated 8-zone intelligent BGA Chip Removal Reflow Oven, designed specifically for professional BGA chip removal applications. With precise temperature control, reliable process stability, and industrial-grade quality, it provides an efficient and safe solution for chip recycling, electronics repair, and semiconductor refurbishment.
The Shengdian Chip Removal Reflow Oven features 8 independently controlled heating zones, each capable of individual temperature adjustment under the centralized control of an industrial PLC system.
Users can create optimized thermal profiles according to different PCB materials, package types, and soldering requirements.
The heating profile is specifically designed for BGA chip removal:
Zones 1–5: Progressive preheating gradually raises the PCB temperature, minimizing thermal shock and ensuring uniform heat distribution.
Zones 6–7: Constant temperature soaking allows solder joints to reach complete reflow, significantly improving chip removal success rates.
Zone 8: Adjustable according to different product characteristics, providing optimized process control and enhanced protection for both the PCB and the BGA component.
This multi-stage heating process effectively minimizes PCB warpage, pad damage, and thermal stress, helping maximize the recovery rate of reusable BGA chips.
The entire system is controlled by an industrial PLC, managing all eight heating zones through 16 solid-state relays (SSR) for highly accurate and stable temperature regulation.
The electrical layout is clean and well-organized, making maintenance and troubleshooting faster and more efficient.
Compared with conventional heating systems, the Shengdian solution offers:
High-precision temperature control
Excellent process repeatability
Easy operation with minimal training
Convenient maintenance
Reliable long-term production stability
The conveyor system is powered by a Panasonic variable frequency drive (VFD) combined with a three-phase motor, providing precise speed adjustment and stable transportation.
This ensures that every PCB receives consistent heating throughout the entire process while accommodating different production requirements.
The heating system utilizes premium Nickel-Chromium (NiCr) heating wires, known for their excellent resistance to oxidation, high-temperature durability, long service life, and uniform heat generation.
Even under continuous industrial operation, the heating performance remains stable, ensuring reliable production over extended periods.
To improve operational reliability, Shengdian has incorporated multiple protection mechanisms into the equipment.
Each heating zone is equipped with an independent protection circuit.
If a short circuit occurs in one heating zone, only that specific zone is disconnected without affecting the operation of the remaining zones.
In addition, if a heating element becomes open-circuit, the machine will not trigger a complete shutdown, allowing maintenance personnel to quickly identify and replace the faulty component while minimizing production downtime.
Following Shengdian's design philosophy of "Smarter Equipment, Simpler Operation," the system features an intuitive user interface and easy parameter configuration.
Both experienced engineers and new operators can quickly learn to operate the equipment, reducing training time while improving production efficiency.
As global electronics manufacturers place greater emphasis on sustainability and resource recycling, recovering valuable BGA components has become an increasingly important part of modern electronic manufacturing and repair.
The Shengdian Dedicated BGA Chip Removal Reflow Oven delivers precise thermal management, reliable process consistency, and industrial-grade durability, enabling customers to improve chip recovery yield while providing an ideal foundation for subsequent reballing, testing, and reuse.
Shengdian specializes in the research, development, and manufacturing of BGA rework equipment, chip removal systems, and SMT intelligent manufacturing solutions. We are committed to providing professional, efficient, and reliable equipment to customers worldwide, helping maximize the value of every semiconductor component.
