6-Zone Reflow Oven with 12 Independent Heating Zones

1. Adopting a liquid crystal computer with Windows 7 + intelligent Siemens control system, adopting modular temperature control with high precision of ±1℃ to ensure the stability and reliability of the control system. Supports offline operation in case of an accidental PC freeze without affecting production, ensuring system stability.

2.Windows 7 operating system with powerful functions and user-friendly interface; features a one-key system restore function.

3.The upper chamber is opened via a pneumatic cylinder lifting mechanism, ensuring safe and reliable operation. 

4.Equipped with mesh belt tensioning device, smooth transportation, no jitter, no deformation, to ensure smooth transportation of PCB;

5.Synchronous guide rail mechanism (can connect online with fully automatic pick-and-place machines and board unloaders), ensuring high width-adjustment precision, long service life, and anti-torsion capability.

6.Manual control lubrication system; oil volume and timing are manually controlled to lubricate the conveyor chain.

 7.All heating zones are controlled by computer with PID control (can be turned on individually by temperature zones. Can be partitioned heating to reduce the starting power, warming time of 10-15 minutes);

 8. Mesh/chain transmission by the computer for full closed-loop control, to meet the different varieties of PCB simultaneous production

 9.Audible and visual fault alarm system with LED lights.

10.Utilizes world-leading hot air circulation technology with high-efficiency pressurized ducts, significantly increasing circulating hot air flow. Offers rapid temperature rise and high thermal compensation efficiency for high-temperature soldering and curing.

11.Independent temperature sensors in each zone provide real-time monitoring and balance compensation.

12.Password-protected OS prevents unauthorized parameter changes. Operation logs enable traceability of parameter modifications. Stores existing temperature/speed settings and profile data with printing support.

13.Integrated control window for convenient computer startup/shutdown, profile testing, printing, and data transmission. Built-in 3-channel online temperature profiling system for real-time PCB temperature checking (no external profiler required).

14.International-standard rapid cooling system using magnified, concentrated, high-efficiency cooling; cooling rates reach 4–8°C/sec with easy management, ensuring optimal solder joint crystallization.

15.Rosin recovery system: Installed at oven inlet and outlet; easy, quick, and flexible maintenance

16.Advanced Air Circulation: Special pressurized air structure and shaped heating elements ensure zero noise/vibration and extremely high heat exchange efficiency. meets strict lead-free process demands for high-difficulty soldering.