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Desktop Reflow Oven


Size:	SD-2015 SD-2520
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Model:
SD-2015
Brand:
SHENGDIAN

As an experimental-grade reflow soldering equipment, the Desktop Reflow Oven machine has the following core features and functions:
Core Features
‌Compact Modular Design‌
Adopting a drawer-type structure, it has a desktop-sized volume that saves space, is easy to maintain, and supports non-standard customisation.
‌Precise Temperature Control Technology‌
Independent temperature zone control (±2°C accuracy), with a maximum temperature difference of 100°C between adjacent zones without temperature crossover.
Infrared uniform heating combined with an independent small-cycle air circulation system, enabling rapid thermal compensation (temperature difference <5°C).
‌High-performance configuration‌
Patented heating wire technology achieves rapid heating in 20 minutes, reducing energy consumption by 30%.
Optional forced cooling and flux recovery systems are available to meet environmental requirements.

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Product Description

Core Functions

High-Precision Welding

The dual welding zone design, combined with ±10 mm/min transmission accuracy, perfectly suits BGA/CSP and 0201 micro-component welding, eliminating displacement defects.

R&D and Debugging Support

Flexible adjustment of parameters in each temperature zone, supporting eight-line temperature curve testing (△T≤8℃), accelerates lead-free process development.

‌Multi-scenario Adaptability‌

From laboratory prototyping to small-scale production, particularly suitable for sample verification in high-reliability fields such as medical electronics and aerospace.