PCB Curing Oven with Instrument Panel are primarily used for automated soldering of through-hole components to circuit boards. Their core functions and technical advantages are as follows: Core Functions High-efficiency batch soldering By immersing the entire PCB board with through-hole components into molten tin (250–280°C), all through-hole solder joints are completed in a single process, significantly improving production efficiency. This is particularly suitable for through-hole processes and SMT red glue surface soldering. Ensuring Solder Joint Reliability Precise control of immersion depth (1/2–2/3 of PCB thickness) and angle (5–10°) ensures full solder filling of through-holes, achieving 100% solder penetration and eliminating missed or incomplete solder joints. Solder joints are full and smooth, with high mechanical strength and excellent vibration and crack resistance, meeting the demands of high-reliability fields such as medical and automotive electronics. Compatible with complex PCB designs Suitable for single/double-sided, multi-layer high-density circuit boards, with unique advantages for densely laid-out or large pad through-hole components (such as transformers and connectors).
