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Four Temperature Zones Reflow Oven


Size:	SD-400 SD-600 SD-800 SD-1000 SD-1200
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Model:
SD-400
Brand:
SHENGDIAN

1. It adopts LCD computer + Intelligent Siemens control system and adopts modular temperature control system with high precision of ± 1 °C (if the computer crashes accidentally, it can work offline without affecting production) , which guarantees the stability and reliability of the Control System; 2. Windows 7 operating interface, powerful, easy to operate, and with a key reduction system; 3. The upper furnace body is opened with a double cylinder jacking machine to ensure safety and reliability 4. Equipped with net belt tension device, smooth transportation, no jitter, no distortion, to ensure smooth PCB transportation; 5. The transmission mechanism of synchronous Guide Rail (can connect with automatic mounter on-line) to ensure accurate width adjustment of guide rail, High Service Life and anti-button curve; 6. Manual control lubrication system, refueling time manually controlled by the amount of oil, lubrication transmission chain; 7. All heating areas are PID controlled by computer (can be divided into separate temperature areas opened separately. Can Be divided to reduce the starting power, heating time 10-15 minutes) ; 8. The network/chain transmission is controlled by computer in full closed loop, which can meet the needs of different kinds of PCB production 9. Has the breakdown sound and light alarm function (uses the LED lamp) ; 10. It adopts the world-leading hot air circulation heating mode of Heller, high-efficiency pressurization type accelerating air duct, greatly improves the circulation hot air flow rate, raises the temperature quickly, has high thermal compensation efficiency, can carry on the high temperature welding and curing; 11. Temperature zone is equipped with independent temperature sensor, real-time monitoring and compensation of the temperature balance of the temperature zone; 12. Have Password Management of the operating system, to prevent unrelated personnel change process parameters, operation records management traceable process parameters change, easy to improve management. The utility model can store the user's existing temperature speed setting and the temperature curve under the setting, and can print all the data and the curve; 13. Integrated Control Window, computer switch, test curve, print curve and transfer data are easy to operate, design humanization. Equipped with three-channel temperature curve on-line testing system, it can test the actual temperature curve of the welding object at any time (without additional temperature curve Tester) ; 14. Specially designed pressurized air transport structure and shaped heating wire design, no noise, no vibration, with high heat exchange rate, the temperature difference △t between BGA bottom and PCB board is extremely small, most in line with the strict requirements of lead-free process, especially for high-difficulty welding requirements of lead-free products.

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Product Description

Reflow Soldering Temperature Zone Distribution

Reflow soldering is generally divided into four temperature zones: preheating zone, absorption zone, reflow zone, and cooling zone. Each temperature zone corresponds to different reflow effects and reflow temperature curves.

Preheating Zone

The purpose of preheating is to preheat components to an appropriate temperature, activate the solder paste, and allow the flux solvent to evaporate appropriately as the temperature rises, preventing solder paste collapse and splattering. Temperature rise rate: Typically specified as 2°C/s to 4°C/s, with a duration of 90 to 150 seconds.

Constant Temperature Zone

The constant temperature zone is designed to stabilise the temperature of various components inside the reflow oven, minimising temperature differences. Since PCB board components vary in size, smaller components heat up faster while larger components heat up slower. This ensures that all components reach a balanced temperature, preventing significant temperature differences that could cause component failure.

Welding Zone

The soldering zone is the area where the temperature reaches its peak, fully melting the tin particles in the solder paste and evaporating the flux. During this stage, the electronic components and PCB board are heated to a sufficiently high temperature to melt the flux and react with the components and PCB pads, achieving a soldered connection.

Cooling Zone

The primary function of the cooling zone is to rapidly solidify the solder joints. Quick cooling ensures good soldering quality; if cooling is too slow, the solder paste may react with moisture in the air, leading to poor soldering quality. The cooling rate in the cooling zone generally does not exceed -4°C/s, and cooling to approximately 50°C is sufficient.

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