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Offline Selective Soldering Machine


Size:	SD-400
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Model:
SD-400
Brand:
SHENGDIAN

DIP Offline Selective Soldering Machine achieves a breakthrough in core technology through precise localised soldering techniques in electronic manufacturing. Its primary applications are as follows:
Resolving soldering challenges in high-density mixed-assembly boards
Avoiding thermal damage to surface-mount components
Traditional wave soldering requires the entire board to be immersed in tin, and high temperatures can cause surrounding surface-mount components (such as BGA chips) to remelt. Selective wave soldering uses a CNC nozzle (with a precision of 0.1mm) to spray dynamic tin waves only onto the pins of through-hole components, protecting the structural integrity of sensitive components.
Eliminating micro-pitch bridging defects
By independently adjusting parameters for each solder joint (temperature/time/solder volume), single-point soldering is achieved for pins with 0.5mm spacing, reducing bridging rates to below 0.03%, far below the industry average of 5% for traditional wave soldering.

Wave Soldering Machine

Product Description

Engineered Superiority: Breakthrough Tech in SHENGDIAN Offline Selective Soldering

01 / High-Density Mixed-Assembly Soldering Breakthrough

Master complex PCBA designs with ease. Traditional wave soldering subjects the entire board to high thermal stress. The SHENGDIAN offline selective soldering machine applies precise localized heat and dynamic flux/tin delivery solely to through-hole pins, eliminating heat distortion and thermal damage to nearby SMT components.

02 / $\pm0.1\text{mm}$ High-Precision CNC Dynamic Nozzle Control

Zero thermal damage to sensitive SMT components. Equipped with a high-precision multi-axis CNC movement module, the machine’s dynamic nozzle targets pins down to $0.1\text{mm}$ positioning accuracy, ensuring surrounding BGA chips, sensors, and delicate plastic components remain completely protected from heat exposure.

03 / Micro-Pitch Single-Point Parameter Adjustment (<0.03% Bridging)

Eliminate costly manual touch-ups and defects. Operating with independent per-joint parameter setting (soldering temperature, dwell time, and tin wave height), the machine achieves flawless single-point soldering on fine-pitch pins as narrow as $0.5\text{mm}$. It slashes bridging defect rates to under $0.03\%$, far outperforming the $5\%$ industry average for traditional wave soldering.

04 / Factory-Direct DIP Line Integration & Turnkey OEM/ODM Capabilities

Optimize your SMT/DIP manufacturing throughput. SHENGDIAN provides customized DIP line solutions tailored to your factory layout, offering custom conveyor heights, specialized board fixtures, custom software protocol integration, and complete private-label OEM equipment branding backed by certified ISO quality standards.