SMT Nozzle Cleaning Machine

The nozzle cleaning machine is a specialised device for cleaning the nozzles of SMT placement machines. It employs high-pressure water mist and ultrasonic technology to remove contaminants such as solder and flux, thereby avoiding physical damage caused by traditional steel needle cleaning or ultrasonic cleaning methods. With the miniaturisation of electronic components (e.g., 0402, 0201 components) and the widespread adoption of lead-free processes, conventional cleaning methods can no longer meet the micron-level aperture cleaning requirements.

II. Core Technologies

Cleaning Methods

High-Pressure Water Mist Pulses: Industrial pure water or deionised water is atomised and ejected at sonic velocity (360m/s), creating an energy field that shatters contaminants.

‌Ultrasonic Cavitation Effect: Certain models incorporate ultrasonic waves to soften contaminants, enhancing cleaning efficiency.

‌Gas-Liquid Two-Fluid Spraying: Some equipment employs compressed air mixed with cleaning solution for micro-pore cleaning.

‌Automated Control

Utilises PLC control modules integrating vision inspection, air drying, flow detection and other functions to achieve full-process automation.

Select models support QR code recognition and nozzle elasticity detection to ensure post-cleaning placement accuracy.

III. Product Advantages

High-Efficiency Cleaning

Capable of cleaning 12-36 nozzles per cycle, accommodating inner diameters ranging from 0.033mm to 2.0mm.

Compared to traditional methods, placement success rates increase by 32% with significantly reduced scrap rates.

‌Environmental Safety‌

Utilises industrial deionised water or purified water (pH 5-7), non-toxic and harmless with liquid recycling capability.

304/316 stainless steel construction prevents rust and avoids secondary contamination.

‌Compatibility‌

Compatible with nozzles from leading placement machines including Siemens and Fujitsu, supporting multiple tray models.