The SMT nozzle cleaner is an automated device specifically designed for cleaning pick-and-place machine nozzles. Utilising high-pressure water mist and ultrasonic technology, it removes contaminants such as solder and flux from micron-level apertures, thereby enhancing placement accuracy and yield rates.
I. Core Functions and Technology
Cleaning Principle
Compressed air atomises deionised water to generate supersonic (360m/s) high-pressure mist that impacts the nozzle surface and internal bore, preventing physical damage.
Select models incorporate ultrasonic technology to enhance cleaning efficacy against stubborn residues.
II. Applicable Scenarios
Compatible with micro-nozzles for components such as 0402 and 0201 (inner diameters 0.033mm–2.0mm), resolving micron-level aperture cleaning challenges unattainable by conventional methods.
Suitable for high-precision placement requirements including lead-free processes, reducing nozzle scrap rates by over 32%.
III. Selection Recommendations
Performance Prioritisation
High-pressure mist models are essential for miniaturised production (e.g., 01005 components).
For high multi-brand compatibility requirements, prioritise models supporting customised cleaning programmes.
Cost Control
Entry-level models suit budget-constrained scenarios, while premium units cater to high-precision production lines.
IV. Maintenance Essentials
Regularly clean vacuum manifold filters, inspecting them every 160 hours.
Use industrial-grade purified or deionised water to prevent scale buildup clogging nozzles.