Brief:PCB Curing Oven with Instrument Panel are primarily used for automated soldering of through-hole components to circuit boards. Their core functions and technical advantages are as follows: Core Functions High-efficiency batch soldering By immersing the entire PCB board with through-hole components into molten tin (250–280°C), all through-hole solder joints are completed in a single process, significantly improving production efficiency. This is particularly suitable for through-hole processes and SMT red glue surface soldering. Ensuring Solder Joint Reliability Precise control of immersion depth (1/2–2/3 of PCB thickness) and angle (5–10°) ensures full solder filling of through-holes, achieving 100% solder penetration and eliminating missed or incomplete solder joints. Solder joints are full and smooth, with high mechanical strength and excellent vibration and crack resistance, meeting the demands of high-reliability fields such as medical and automotive electronics. Compatible with complex PCB designs Suitable for single/double-sided, multi-layer high-density circuit boards, with unique advantages for densely laid-out or large pad through-hole components (such as transformers and connectors).
Brief:As an experimental-grade reflow soldering equipment, the Desktop Reflow Oven machine has the following core features and functions: Core Features Compact Modular Design Adopting a drawer-type structure, it has a desktop-sized volume that saves space, is easy to maintain, and supports non-standard customisation. Precise Temperature Control Technology Independent temperature zone control (±2°C accuracy), with a maximum temperature difference of 100°C between adjacent zones without temperature crossover. Infrared uniform heating combined with an independent small-cycle air circulation system, enabling rapid thermal compensation (temperature difference <5°C). High-performance configuration Patented heating wire technology achieves rapid heating in 20 minutes, reducing energy consumption by 30%. Optional forced cooling and flux recovery systems are available to meet environmental requirements.
Brief:Vacuum reflow soldering, as an advanced soldering technology, plays a crucial role in multiple aspects: Prevents oxidation of solder joints, ensuring robust and reliable soldering, and enhancing overall soldering quality. Utilises vacuum pressure differences to remove bubbles from molten solder, significantly reducing porosity (to below 10%, and as low as 3–5% under optimal conditions), thereby improving the density and purity of solder joints. Improving the electrical conductivity, thermal conductivity, mechanical strength, sealing performance, and pressure resistance of solder joints, thereby enhancing device reliability. Reducing soldering defects (such as porosity or impurities), preventing damage to chips and substrates, and improving product yield. Enabling flux-free soldering, reducing environmental pollution and environmental protection costs. Minimising thermal stress through precise temperature control (such as infrared uniform heating), ensuring uniform solder melting and avoiding overheating issues. Easy to operate and learn, improving production efficiency and adapting to diverse application scenarios (such as high-density packaging of chip capacitors, inductors, etc.) Widely applied in high-reliability fields such as aerospace, military electronics, medical devices, and automotive electronics, meeting stringent quality requirements
Brief:The mini reflow soldering machine (also known as desktop reflow soldering) is a compact soldering device designed for R&D, small-batch production, and special scenarios. Its core function is to meet specific soldering needs at low cost and with flexible operation, complementing traditional large multi-zone reflow soldering machines. Core Functions and Positioning Differences R&D Validation and Small-Scale Production Suitable for new product prototype testing and process parameter tuning (e.g., lead-free solder experiments), avoiding the use of large-scale production line resources and significantly reducing R&D costs. Repair and Rework Support Enables localised rework on individual PCBs, precisely controlling the soldering position (e.g., BGA chip rework), avoiding secondary damage caused by re-flowing the entire board. Educational and Training Tools Used in electronics-related academic institutions to demonstrate the entire SMT reflow soldering process (preheating → reflow → cooling), providing an intuitive demonstration of solder joint formation mechanisms.
Brief:SMT Shuttle Conveyor with Double Cart (also known as translational machines) are core equipment in SMT production lines for achieving track misalignment translational transfer and connection. They are primarily used to optimise production line layout, improve equipment utilisation, and reduce operating costs. Dynamic integration of production line tracks Single-track and dual-track equipment integration Resolves track misalignment issues between single-track pick-and-place machines and dual-track reflow/wave soldering machines by precisely translating PCBs to achieve seamless equipment integration, thereby avoiding efficiency losses and quality risks caused by manual handling. Production Line Splitting and Merging Supports modes such as ‘one-in-two-out’ (single-track splitting into dual-track) and ‘two-in-one-out’ (dual-track merging into single-track), flexibly adapting to production needs for merging multiple lines or expanding a single line, such as two placement lines sharing a single reflow oven.
Brief:A belt conveyor is a material handling device that uses a continuously moving belt as its load-bearing component. Its core function is to achieve efficient, continuous material transport and can be integrated with specific process handling. 1. Core Material Conveying Function Continuous Spatial Transfer Enables horizontal, inclined, or vertical material transport along a fixed route, supports the formation of complex spatial conveying routes, replaces manual handling, and significantly improves production line efficiency. Adaptability to Various Material Forms It can transport bulk particles (such as grains, chemical raw materials) as well as individual items (such as packaged boxes, bagged goods), with an application range spanning from dry materials to components requiring cleaning. 2. Production Process Integration Process Integration Simultaneously performs cooling, cleaning, and draining operations during transportation. For example, trough-type mesh belt conveyors use water trough designs to directly cool or clean high-temperature workpieces with water; oil treatment processes achieve automatic oil separation. Harsh Environment Adaptation Stainless steel mesh belts meet hygiene standards for industries such as food and pharmaceuticals, support quick disassembly and cleaning, and prevent cross-contamination.
Brief:The SMT Synchronous Belt PCB Conveyor plays a core role in transmission and coordination in electronic manufacturing production lines. Core transmission functions: 1. High-precision synchronous transmission Utilising a synchronous belt design with tooth-tooth engagement, precise alignment between the belt teeth and gears ensures zero slip transmission, maintaining PCB transmission position deviation within ±0.1mm and preventing component misalignment during the placement process. Compared to friction-driven flat belts, synchronous belts can withstand heavier loads (e.g., 10kg fixtures) and exhibit a 40% improvement in resistance to tensile deformation. 2. Stepless speed adjustment to match production line cycle time Stepper motor-driven synchronous belts allow precise speed adjustment within the range of 0.5–12 metres per minute, flexibly matching the speed differences between pick-and-place machines and reflow soldering machines to resolve production rhythm mismatches between equipment.
Brief:The SMT Reject Conveyor significantly improves the efficiency and quality control capabilities of electronic manufacturing lines by integrating intelligent sorting and buffering functions. Its core advantages are as follows: Core functional advantages: 1. Intelligent Sorting and Quality Isolation By receiving NG signals from AOI/SPI inspection equipment via photoelectric sensors, the system automatically switches defective PCBs to the auxiliary track for transportation to the repair area, preventing defective products from entering critical processes such as reflow soldering. The interception rate can reach 99%23. Qualified products are directly transported to the next process via the main track, achieving fully automated quality diversion. 2. Efficient Dual-Track Parallel Caching The dual-track design supports simultaneous caching of multiple PCBs (typical capacity of 20 pieces). The main track is used for normal production flow, while the auxiliary track serves as an emergency caching zone. When the pick-and-place machine is at full capacity or downstream equipment malfunctions, the auxiliary track continues to receive PCBs, maintaining 50% production capacity and minimising downtime losses.
Brief:The SMT Dual Rail PCB Reject Conveyor is a critical connecting device in electronic manufacturing production lines. It achieves efficient production scheduling and quality control through a dual-track parallel design and intelligent screening functions. Core Functions: Parallel Processing and Screening Diversion 1. Dual-Track Synchronous Operation Featuring an independently controlled dual-track structure, it can simultaneously transport two PCB boards, doubling production line efficiency. When the main track equipment (e.g., pick-and-place machine) is at full capacity, the backup track automatically activates diversion to prevent production interruptions. 2. Intelligent Screening Mechanism Integrated with photoelectric sensors and a software control system, it automatically diverts defective products based on inspection results (e.g., AOI/SPI data): Passed Products: Proceed along the main track to the next process (e.g., reflow soldering) Defective Products: Switch to the auxiliary track and transport to the repair station or re-inspection area Screening Logic: Receives instructions from upstream and downstream equipment via the SMEMA signal interface, and combines with the PASS button to switch between manual and automatic release modes.
