Brief:The DIP Wave Solder In-feed Conveyor (also known as the automatic feed transfer station) is a key front-end device in the wave soldering production line. Its primary functions include precise positioning, buffering storage, and automated transfer of PCB boards, ensuring the continuity and stability of the soldering process. Automated Positioning and Transfer Through precise rail adjustment (compatible with widths typically ranging from 50 to 350 mm), it precisely aligns with preceding processes (such as the insertion line), feeding PCBs into the preheating zone at a pre-set angle (typically 5° to 7°), thereby avoiding shifts or collisions caused by manual board placement.
Brief:The steel mesh inspection machine (also known as steel mesh detection equipment) is a core device used in electronic manufacturing to control the quality of SMT steel mesh. Its core function is to prevent solder paste printing defects at the source through high-precision optical detection technology, thereby improving the yield rate of SMT production lines. The following are its specific functions and values: Core Functions Steel mesh aperture quality inspection Precise measurement of aperture dimensions, positional offset, and area error (with accuracy down to the micrometre level), identifying defects such as multiple apertures, missing apertures, foreign object blockages, and burrs, ensuring precise and accurate solder paste deposition. Supports tension testing (e.g., steel mesh relaxation), preventing printing deformation caused by insufficient tension.
Brief:SMT Offline AOI Inspection Equipment (Automatic Optical Inspection) is an optical inspection system independent of the production line, primarily used for in-depth analysis of printed circuit board (PCB) assembly quality and process optimisation in electronic manufacturing. Its core functions and advantages are as follows: Core Functions In-depth defect detection Performs high-precision full inspection on PCBs that have been completed with component placement or soldering, identifying defects such as misplaced components, missing components, reversed polarity, misalignment, and tombstoning in component placement, as well as defects like cold solder joints, bridging, insufficient solder, and solder balls in soldering. Supports 3D scanning technology to precisely measure solder joint height and morphology, detecting hidden solder joint issues in BGA, QFN, and other components. Process Data-Driven Optimisation Analyses inspection data using SPC (Statistical Process Control) to generate defect distribution maps, first-pass yield trends, and other reports, providing a basis for adjusting placement parameters, solder paste printing pressure, and other processes. Case Study: A company reduced solder joint bridging defect rates from 0.8% to 0.03% through offline AOI data analysis. Flexible Adaptation to Multiple Scenarios Compatible with both sampling and full inspection: Can perform full inspection for small-batch, high-reliability products (e.g., medical, automotive electronics) or sampling quality inspection for large-batch products. Non-real-time intervention: Operates independently of the production line, with the inspection process not affecting the mainline cycle time, making it suitable for in-depth analysis of complex boards with high repair difficulty.
Brief:SMT Lifting Machine Features 1. Enclosed design ensures the highest safety protection level 2. The top safety cover can be opened for convenient maintenance of machine hardware 3. Micro-adjustable feed and exit heights ensure accurate alignment and conveyance of PCB boards 4. Stable and balanced width adjustment mechanism (manually controlled screw rod adjustment) 5. Compact machine footprint 6. Compatible SMEMA interface
Brief:Automatic Destacker Loader And Unloader Machine (also known as the stacking and feeding integrated machine) is an automated integrated device in the SMT production line that combines the functions of feeding (stacking) and collecting boards. Its core function is to achieve the automatic supply of bare PCBs and the efficient collection of finished boards through intelligent mechanical structures. Core Functions Automated Stacking (Board Feeding) Raw Board Supply: Stacked PCB blanks are precisely fed into the production line track one by one via push plate cylinders or conveyor belts, responding to board request signals from downstream equipment (such as printers), thereby replacing manual board placement operations. Dual-mode switching: Supports stacking mode (entire stack of bare boards) and loading mode (automatic board supply from turnover boxes), enabling flexible switching between single- and double-sided mounting processes. Intelligent board retrieval (unloading) Finished board recovery: After receiving the signal indicating completion of component placement, the system automatically places the PCB boards with components into material trays, achieving end-of-line board retrieval functionality and preventing oxidation of pads caused by manual contact.
Brief:SMT Automatic Destacker Loader Machine (also known as a layer-stacking board feeder or automatic board feeder) is a core automated device primarily used for front-end board feeding operations in SMT (Surface Mount Technology) production lines, enabling efficient automatic transmission and stacking of bare PCBs. Its primary function is to replace manual labour with automated mechanisms, feeding stacked PCB blanks one by one into the production line track to ensure smooth production workflow. Specifically, after receiving signals from downstream equipment (such as pick-and-place machines or printers), it uses push plate cylinders or conveyor belt mechanisms to precisely drop or push PCB boards onto the transmission track, eliminating the cumbersome manual stacking process.
Brief:First Article Inspection Machine with Scanning Function 1. Efficient Operation and Cost Savings Efficient single-person operation: Only one person is needed to complete the inspection task (traditional methods require 2-3 people to collaborate), significantly reducing labour costs. Significant increase in inspection speed: Through intelligent navigation and automatic data collection, inspection time is reduced by 50%-80%, effectively shortening the production line waiting cycle. 2. Intelligent Inspection and Error-Proofing Mechanism Automatic Program Generation: After importing the BOM file, CAD coordinates, and PCB scan images, the system automatically generates the inspection path without manual programming (taking only 2-5 minutes). Dynamic Navigation Assistance: Real-time highlighting of the positions of components to be tested, with support for image zoom and rotation, to prevent manual positioning errors. Prevention of missed inspections and misjudgments: Automatically identifies untested components, combines LCR tester automatic readings with standard values, and instantly determines results (PASS/NG), eliminating human error. III. High-Precision Inspection and Data Management Precise measurement tools: Uses a high-precision LCR bridge instead of a multimeter, automatically adjusts the range, and ensures accurate measurement of electrical parameters of components such as resistors, capacitors, and inductors. Optical Automatic Comparison: Visually identifies components with silk screen markings, such as ICs and diodes, and automatically detects defects such as incorrect orientation and misalignment. Traceability Assurance: Automatically records and stores test data, generates Excel reports containing timestamps and measurement values, supports scenario reconstruction and database archiving, and meets ISO quality traceability requirements.
Brief:SMT ovens are core equipment in surface mount technology, with key features including precise temperature control, efficient production, and process adaptability: Core Features Precise Temperature Control System Utilises an intelligent PID control system or microcomputer temperature controller, achieving temperature control accuracy of ±2°C to ensure uniform and stable temperatures inside the oven and prevent local overheating that could damage components. The preheating zone to the reflow zone employs multi-zone independent temperature control (typically 4–10 zones), supporting stepwise temperature ramp-up curves to meet the thermal sensitivity requirements of different PCB materials and components. Infrared heating technology combined with a hot air circulation system ensures an internal temperature difference of ≤5℃, eliminating soldering defects caused by the ‘shadow effect.’ Efficient production and automation Integrated automated conveyor chain (±10 mm/min precision) supports online connection with pick-and-place machines, enabling continuous production. Rapid heating design (reaches operating temperature in 10-15 minutes) reduces power consumption by 30%-40% compared to traditional equipment. Equipped with SPI online detection functionality, real-time adjustment of process parameters achieves a yield rate of over 99.8%.
Brief:First Article Inspection Machine has the following core features and technical advantages: Intelligent testing process Automatic generation of testing procedures By integrating BOM files, CAD coordinates, and PCB drawings, the system automatically synthesises testing paths without the need for manual programming, greatly reducing preparation time (approximately 2-5 minutes). Dynamic Navigation and Automatic Judgment During testing, the system highlights the positions of components to be tested, supports image zoom, pan, and rotate functions, and assists in determining component orientation. LCR test data is automatically read and matched with component standard values, with instant results (PASS/NG) to avoid human misjudgment.
