Dip Soldering Machine Standard Operating Procedures And Key Points

Dip Soldering Machine Standard Operating Procedures and Key Points:

‌1. Operating Procedures‌

‌Equipment Preheating‌

Turn on the machine 60 minutes in advance. Set the solder pot temperature to 250–280°C (lead-free process requires 260°C ± 5°C).‌

Maintain a stable air pressure of 0.5 MPa (if the equipment is equipped with an air pressure system).‌

‌Flux Treatment‌

Only allow the copper foil side of the PCB to come into contact with the flux to prevent component contamination.‌

The spray system must be cleaned weekly with alcohol to clean the nozzles and recovery box.‌

‌Immersion Soldering Operation‌

Immerse the PCB into the solder bath at a 5-10° angle (recommended angle below 30°).‌

Depth control: 50%-70% of the board thickness; immersion time strictly limited to 3-5 seconds.‌‌

After completing 4 PCBs, remove the tin oxide layer.

‌Post-soldering treatment‌

Lift the board at a 5-10° angle at a constant speed to avoid sharp solder joints.

Move to a safe area for natural cooling; do not touch the uncured board surface.

After cooling, place sideways on anti-static equipment; store different models separately.

‌II. Safety and Quality Control‌

‌Personal Protection‌

Maintain a minimum distance of 30 cm from the solder tank during operation and wear an anti-static wristband.‌

‌Pre-Soldering Inspection‌

Ensure components are properly aligned and not floating, with particular attention to IC orientation.‌

‌Post-Soldering Inspection‌

Solder joints must be fully filled with no missed solder, cold solder joints, short circuits, or solder balls.‌

Defective units must be marked with a red label and recorded.‌

‌III. Equipment Maintenance‌

‌Daily Maintenance‌

Immediately clean solder residue/flux residue after shutdown, and wipe the equipment surface with alcohol.‌

‌Special Maintenance‌

Clean the flux spray system weekly: switch to alcohol mode for automatic rinsing.‌

Remove carbon deposits from the preheater area weekly.‌

‌4. Abnormal Condition Handling‌

If soldering is incomplete, perform a secondary dip soldering (increase speed).‌

Immediately trigger the emergency stop button in case of equipment malfunction.