Features and Future Development Directions of Reflow Soldering Machines

As a core piece of equipment in electronic manufacturing, the technical features and development directions of reflow soldering machines can be summarised as follows:

I. Core Features

Highly Automated

Supports the entire process of PCB board automatic conveying, heating, soldering, and cooling, significantly improving production efficiency and reducing human error.

Compatible with belt/track conveyance, can be integrated with pick-and-place machines to form a continuous production line.

Precise Temperature Control

Utilises a PID global temperature control system, with temperature fluctuations ≤ ±0.2°C and lateral temperature differences ≤ ±2°C.

Features an independent multi-temperature zone design (at least 8 zones), with a preheating zone temperature rise rate of 1–3°C/s to avoid thermal shock; the peak temperature in the reflow zone ranges from 230–255°C.

‌Energy-saving and environmentally friendly features‌

High-efficiency finned heating tubes combined with hot air circulation improve heat utilisation efficiency by 30%.

Stainless steel furnace chamber integrated with environmentally friendly insulation cotton reduces repeated heating power consumption; split exhaust system effectively filters acidic gases.

‌Production flexibility‌

Supports lead-free/lead-containing solder switching to accommodate different alloy composition requirements.

Conveyor belt width and speed are infinitely adjustable (0.1–1.2 m/min), compatible with various PCB sizes.

II. Future Development Directions

‌Intelligent Upgrades‌

AI algorithms are introduced to optimise temperature curves in real time and predict equipment failures (accuracy > 95%).

5G networking enables remote monitoring and builds a smart manufacturing closed-loop system.

Modularisation and Integration

Equipment components support quick disassembly and assembly for easy maintenance and upgrades; integration with cutting and inspection equipment to form an integrated production line.

Deepening Green Technology

Promotion of laser welding technology, reducing energy consumption by 50% and carbon emissions by 15 tonnes per year.

Lead-free solder application rate increased to 80%, with dust emissions controlled below 5 mg/m³.

Customised Solutions

Developing specialised equipment for the new energy and aerospace sectors, such as ultrasonic welding machines achieving ±0.01mm precision connections.

‌Key points of technological iteration: Future reflow soldering machines will integrate intelligent decision-making, low-carbon processes, and flexible production, driving the evolution of electronic manufacturing towards high precision and zero defects.