Brief:As an experimental-grade reflow soldering machine, the Desktop Reflow Oven has the following core features and functions: Core Features Compact Modular Design Adopting a drawer-type structure, it has a desktop-sized volume that saves space, is easy to maintain, and supports non-standard customisation. Precise Temperature Control Technology Independent temperature zone control (±2°C accuracy), with a maximum temperature difference of 100°C between adjacent zones without temperature crossover. Infrared uniform heating combined with an independent small-cycle air circulation system, enabling rapid thermal compensation (temperature difference <5°C). High-performance configuration Patented heating wire technology achieves rapid heating in 20 minutes, reducing energy consumption by 30%. Optional forced cooling and flux recovery systems are available to meet environmental requirements.
Brief:Vacuum reflow soldering, as an advanced soldering technology, plays a crucial role in multiple aspects: Prevents oxidation of solder joints, ensuring robust and reliable soldering, and enhancing overall soldering quality. Utilises vacuum pressure differences to remove bubbles from molten solder, significantly reducing porosity (to below 10%, and as low as 3–5% under optimal conditions), thereby improving the density and purity of solder joints. Improving the electrical conductivity, thermal conductivity, mechanical strength, sealing performance, and pressure resistance of solder joints, thereby enhancing device reliability. Reducing soldering defects (such as porosity or impurities), preventing damage to chips and substrates, and improving product yield. Enabling flux-free soldering, reducing environmental pollution and environmental protection costs. Minimising thermal stress through precise temperature control (such as infrared uniform heating), ensuring uniform solder melting and avoiding overheating issues. Easy to operate and learn, improving production efficiency and adapting to diverse application scenarios (such as high-density packaging of chip capacitors, inductors, etc.) Widely applied in high-reliability fields such as aerospace, military electronics, medical devices, and automotive electronics, meeting stringent quality requirements
Brief:The mini reflow soldering machine (also known as desktop reflow soldering) is a compact soldering device designed for R&D, small-batch production, and special scenarios. Its core function is to meet specific soldering needs at low cost and with flexible operation, complementing traditional large multi-zone reflow soldering machines. Core Functions and Positioning Differences R&D Validation and Small-Scale Production Suitable for new product prototype testing and process parameter tuning (e.g., lead-free solder experiments), avoiding the use of large-scale production line resources and significantly reducing R&D costs. Repair and Rework Support Enables localised rework on individual PCBs, precisely controlling the soldering position (e.g., BGA chip rework), avoiding secondary damage caused by re-flowing the entire board. Educational and Training Tools Used in electronics-related academic institutions to demonstrate the entire SMT reflow soldering process (preheating → reflow → cooling), providing an intuitive demonstration of solder joint formation mechanisms.
Brief:1. It adopts an LCD computer + Intelligent Siemens control system and a modular temperature control system with high precision of ± 1 °C (if the computer crashes accidentally, it can work offline without affecting production) , which guarantees the stability and reliability of the Control System; 2. Windows 7 operating interface, powerful, easy to operate, and with a key reduction system; 3. The upper furnace body is opened with a double-cylinder jacking machine to ensure safety and reliability; 4. Equipped with a net belt tension device for smooth transportation, no jitter, no distortion, to ensure smooth PCB transportation; 5. The transmission mechanism of the synchronous Guide Rail (can connect with automatic mounter online) to ensure accurate width adjustment of the guide rail, High Service Life, and anti-button curve; 6. Manual control lubrication system; the amount of oil manually controls refueling time; lubrication transmission chain; 7. All heating areas are PID controlled by computer (can be divided into separate temperature areas opened separately. Can be divided to reduce the starting power, heating time 10-15 minutes); 8. The network/chain transmission is controlled by a computer in full closed loop, which can meet the needs of different kinds of PCB production; 9. Has the breakdown sound and light alarm function (uses the LED lamp); 10. It adopts the world-leading hot air circulation heating mode of Heller high-efficiency pressurization type accelerating air duct, greatly improves the circulation hot air flow rate, raises the temperature quickly, has high thermal compensation efficiency, can carry on the high temperature welding and curing; 11. The temperature zone is equipped with an independent temperature sensor, real-time monitoring and compensation of the temperature balance of the temperature zone; 12. Has password management of the operating system to prevent unrelated personnel from changing process parameters; operation records management traceable process parameters change, easy to improve management. The utility model can store the user's existing temperature speed setting and the temperature curve under the setting, and can print all the data and the curve; 13. Integrated Control Window, computer switch, test curve, print curve and transfer data are easy to operate, design humanized. Equipped with a three-channel temperature curve on-line testing system, it can test the actual temperature curve of the welding object at any time (without an additional temperature curve Tester); 14. Specially designed pressurized air transport structure and shaped heating wire design, no noise, no vibration, with high heat exchange rate, the temperature difference △t between BGA bottom and PCB board is extremely small, most in line with the strict requirements of lead-free process, especially for high-difficulty welding requirements of lead-free products.
Brief:1. It adopts an LCD computer + Intelligent Siemens control system and a modular temperature control system with high precision of ± 1 °C (if the computer crashes accidentally, it can work offline without affecting production), which guarantees the stability and reliability of the Control System; 2. Windows 7 operating interface, powerful, easy to operate, and with a key reduction system; 3. The upper furnace body is opened with a double-cylinder jacking machine to ensure safety and reliability.
Brief:1. Solder paste is placed at 45 degrees and rotates along the axis, so that the paste nolonger adheres to the can lid. 2. Double safety device to ensure personal safety. 3.Stirring at the same time has the effect of removing air bubbles. 4. Special control circuit, fully consider the process control of stirring solder paste. 5. Proven speed ratio, to avoid the impact of the impact of tin powder and temperatur rise too large on the quality of the solder paste.
Brief:The online solder paste printer is a core piece of equipment in SMT (surface mount technology) production lines, used to precisely print solder paste onto PCB pads, providing the foundation for subsequent component mounting. Its core feature is its seamless integration with upstream and downstream equipment (such as pick-and-place machines and reflow ovens) through an automated transfer system, enabling efficient continuous production. Modular design
Stencil system: Made of stainless steel or nickel alloy, with aperture designs customised according to pad dimensions, typically 0.1–0.15 mm thick. Squeegee unit: Made of metal or polyurethane, with an angle of 45°–60°, pressure range of 3–15 N/cm², and speed of 20–80 mm/s, ensuring uniform solder paste filling. Conveyor Track: Automatic board loading/unloading design, compatible with direct integration with pick-and-place machines, minimising manual intervention.
