Brief:The SMT Oven Furnace Temperature Tester plays a central role in temperature monitoring and process optimisation in electronic manufacturing. Its specific functions and technical value are as follows: Real-time, accurate temperature monitoring Dynamic temperature curve recording Synchronised with the PCB board as it enters the reflow oven, it uses multiple thermocouples (typically 6-32 channels) to record temperature changes in each temperature zone in real time, with a measurement accuracy of ±0.3°C. Captures data throughout the entire process from preheating → constant temperature → reflow → cooling, preventing defects such as cold solder joints and voids caused by temperature fluctuations. Temperature deviation anomaly warning Automatically triggers an alarm when temperature deviates from the set threshold (e.g., ±5°C), preventing batch scrap caused by uncontrolled furnace temperature. Process parameter optimisation Analyses temperature curve data, automatically calculates slope, peak temperature, and time window (e.g., duration maintained above 217°C), guiding engineers in adjusting chain speed and temperature zone settings.
Brief:DIP Offline Selective Soldering Machine achieves a breakthrough in core technology through precise localised soldering techniques in electronic manufacturing. Its primary applications are as follows: Resolving soldering challenges in high-density mixed-assembly boards Avoiding thermal damage to surface-mount components Traditional wave soldering requires the entire board to be immersed in tin, and high temperatures can cause surrounding surface-mount components (such as BGA chips) to remelt. Selective wave soldering uses a CNC nozzle (with a precision of 0.1mm) to spray dynamic tin waves only onto the pins of through-hole components, protecting the structural integrity of sensitive components. Eliminating micro-pitch bridging defects By independently adjusting parameters for each solder joint (temperature/time/solder volume), single-point soldering is achieved for pins with 0.5mm spacing, reducing bridging rates to below 0.03%, far below the industry average of 5% for traditional wave soldering.
Brief:SMT material cutting machines (including material feeders, tape cutters, etc.) primarily address material interruptions and waste material handling issues on electronic manufacturing production lines. Their core functions and technical advantages are as follows: Core Functions and Roles Non-stop Material Continuity Utilising high-precision visual recognition and servo control, the machine automatically completes the cutting, joining, and bonding of new and old material strips, eliminating downtime caused by manual material handling and significantly improving production line efficiency. Automated Waste Material Strip Processing Specifically designed for recovering waste material belts from the feeder zone of pick-and-place machines, this system uses a rolling cutting mechanism to sever the material belt and film in one cut. The waste material automatically falls into an anti-static recovery box, maintaining 5S management standards on-site. Data Traceability Management Records the time of each material changeover, consumable part number, and operation location. Integrates with MES/ERP systems to enable process parameter traceability, meeting the stringent quality control requirements of industries such as automotive electronics.
Brief:The Repair Worktable, with its compact structure and precise temperature control capabilities, demonstrates significant advantages in specific scenarios. The following is an analysis of core application scenarios and technical highlights: Core Application Scenarios Micro PCB Repair Station Suitable for repairing small boards ranging from 11×7 cm to 13×13 cm (such as smartwatch mainboards and TWS earphone circuits), with a desktop footprint reduced by 60% compared to standard models. Research and Development Laboratory Testing Supports rapid BGA chip desoldering (±2°C temperature control accuracy), enabling component replacement within 5 minutes to accelerate prototype validation. Educational Training Facilities Semi-automatic models combine optical alignment and touchscreen interfaces to lower the operational threshold for students.
Brief:The core features of the compact rework station are primarily reflected in its compactness, flexibility, and specialised functionality, as detailed below: 1. Compact Structural Design Compact Chassis Specifically designed for scenarios with limited repair space, the typical dimensions are compatible with PCB boards ranging from 11×7 cm to 13×13 cm (e.g., RBN/RBSM series), with a desktop footprint reduced by 60% compared to standard models. Ergonomic stand Supports vertical lifting and horizontal micro-adjustment, allowing operators to adjust the repair angle with one hand. Modular integration Integrated design of the hot air nozzle and placement head eliminates the need for external equipment, enabling ‘pick-place-solder’ single-machine operation. 2. Precise temperature control capability Efficient heating system The upper hot air nozzle achieves a heating rate of 10°C/second, combined with an infrared lower heating zone, to rapidly reach lead-free soldering temperature curves (≥217°C); Three-zone independent control models can preheat the entire PCB, eliminating the risk of thin board deformation (warpage reduced by 70%). Intelligent temperature control algorithm PID closed-loop regulation ensures uniform melting of solder joints, preventing chip overheating damage, and is compatible with 0.3mm micro-pitch BGA rework.
Brief:YAMAHA Pick and Place Machine core approach to improving production efficiency combines automation technology with process optimisation strategies to achieve breakthroughs in production capacity: High-precision motion system Magnetic levitation linear motors and roller belt drive mechanisms are used to achieve positioning accuracy of ±0.025 mm, reducing rework caused by component placement misalignment. Direct-drive rotary placement head design increases placement speed for 0201 micro-components (0.4×0.2mm) by 5% Intelligent Feeding Optimisation Large-capacity reel feeders: 13-inch reels replace 7-inch reels, reducing changeover frequency by 25% and minimising downtime SL feeder (Super Loading Feeder): Supports automatic material pickup, enabling continuous, uninterrupted feeding
Brief:A pick-and-place machine is the core equipment for achieving automatic component placement in electronic manufacturing, with its primary functions as follows: 1. Achieving high-precision component placement Micron-level positioning accuracy Through visual systems (such as high-resolution cameras) and precision motion control mechanisms (such as magnetic levitation linear motors), placement accuracy can reach ±0.025mm, meeting the placement requirements for 01005 micro-components (0.4×0.2mm). For example, flip-chip placement machines can achieve 0.5-micron packaging accuracy, suitable for precision fields such as µLED and MEMS. Intelligent recognition and correction Utilising machine learning algorithms to identify component position deviations, automatically compensating for PCB expansion/contraction errors, achieving 99.8% placement repeatability, and eliminating human operational errors. II. Enhancing Production Efficiency and Flexibility High-Speed Placement Capability The fully automatic model achieves a placement speed of 23,500 CHIP/H (chip components per hour). The turret structure enables simultaneous pick-and-place operations through 180° rotation, improving efficiency by 40%. Multi-component compatibility Adaptive nozzles: Vacuum nozzles accommodate packages from 0201 to 55mm high-power modules, with pneumatic grippers available for irregularly shaped components. Feeding system: Supports multiple feeding types including tape, tube, and tray, with a single line capable of managing over 1,000 material types. III. Ensuring Product Quality and Reliability Soldering Yield Optimisation Precise control of placement pressure (adjustable from 0.1N to 400N) and angle reduces cold solder joints/misalignment, improving BGA chip pin alignment accuracy by 40% and reducing solder joint defect rates to below 0.02%. Interference-resistant design Short-lead or leadless packaging reduces parasitic inductance, enhancing high-frequency circuit performance and supporting signal transmission above 3GHz, suitable for 5G device manufacturing.
Brief:The DIP Lifting Plug-in Line (lifting DIP production line) is an intelligent upgrade of the traditional plug-in line. Its core advantages are reflected in three dimensions: flexible production, human-machine collaboration, and process optimisation. The following is a detailed analysis: Dynamic adaptation to production needs (flexible manufacturing) Highly adjustable The track height can be precisely adjusted within the range of 0.8-1.4m (accuracy ±5mm) through the electronic control system. Application Scenarios: Adapting to operators of different heights (e.g., 155cm female workers vs. 185cm male workers), reducing lower back strain by 30% Raising the track during production of large automotive electronic boards (≥1.2m) to prevent board edge collisions Efficient handling of double-sided mixed-assembly boards The lifting mechanism enables automatic rotation of PCB boards from 0° to 90° to 180° (speed ≤ 3 seconds per cycle) Benefits: Double-sided assembly boards can be transferred without disassembly, reducing process intervals by 40%
Brief:DIP Plug-in Production Line play the following key roles in electronic manufacturing: Adapting to special components Suitable for high-power devices, high-frequency components, and irregular connectors that are not suitable for surface mount technology (SMT). The plug-in process involves soldering pins through PCB holes to ensure the stable installation and heat dissipation requirements of large components (such as relays and transformers). Enhancing structural reliability Through-hole soldering creates a mechanical interlock between the pins and the PCB, achieving a vibration test pass rate of 99.2% and a 40% increase in temperature cycle lifespan, far exceeding the strength of SMT solder joints. This makes DIP technology indispensable in high-reliability fields such as military and automotive electronics. Complementary SMT Process In dual-sided mixed-assembly boards, DIP handles high-power components on the back side (such as power interfaces), while SMT manages precision ICs on the front side, saving over 15% in layout space. The two processes collaborate to achieve full-process manufacturing of complex products. Standardised production process Includes four key stages: Component pre-processing: Trimming leads and establishing a polarity database; Manual insertion: Anti-static operations + dual-person mutual inspection to reduce misinsertion rates; Wave soldering control: Precise regulation of solder bath temperature at 245±3°C; Post-processing: Automatic lead trimming and three-proof coating process.
