AOI Automatic Optical Inspection

Economical AOI Automatic Optical Inspection System; specifically designed for the detection of defects in PCBA components of 0201 size or larger. Key features include: fast programming speed, user-friendly operation, high detection accuracy, effective reduction of labour costs, suitability for small-batch production, and powerful statistical analysis (SPC) functionality that provides comprehensive insight into quality defects. Additionally, our high-precision lead screws and guide rails are imported components, ensuring stable operation and a long service life for the equipment. To better serve our customers, this entry-level AOI automatic optical inspection system offers a free trial service. Main functional configuration parameters of the entry-level AOI automatic optical inspection system

PCB types detected: After reflow oven, after DIP wave soldering, after dispensing, keyboard characters, etc. Detection method: Statistical modelling, full-colour image comparison, automatically sets parameters for different detection points (e.g., offset, polarity, short circuit, etc.)

Industrial Camera: Full-colour CCD high-speed intelligent digital camera with 200W pixels

Resolution: (standard) 20μm/pixel

Field of View (FOV): 32.56×24.72

Inspection Speed: <210ms/FOV (standard configuration)

Substrate size: 20 × 20 mm to 370 × 470 mm Substrate thickness: ±3 mm

Substrate clearance height: Top: ≤30 mm; Bottom: ≤40 mm

Minimum part size for testing: 20 μm: 0402 chip & 0.3 pitch IC

Inspection light source: High-brightness new RRG three-colour coaxial ring-shaped tower-type LED light source (Colour light)

Programming mode: Manual programming, automatic framing, CAD data import with automatic component library matching

Remote control: Enables remote operation via TCP/IP network, allowing real-time monitoring, starting/stopping machine operation, and program modifications from anywhere

Defect detection types: Component defects: Missing parts, misalignment, tilting, standing upright, sideways, flipped, incorrect parts, OCV, damage, reverse orientation, etc.

Solder joint defects: Excessive solder, insufficient solder, cold solder joints, solder bridges, copper foil contamination, etc. Solder paste printing: Presence/absence, misalignment, insufficient solder, excessive solder, open circuits, solder bridges, contamination, etc.

Special features: Simultaneous execution of multiple programs, support for automatic program retrieval; capable of inspecting components rotating 0-359° (in 1° increments)

SPC and process control: Records test data throughout the process for statistical analysis, enables real-time monitoring of production status and quality analysis, and supports exporting data in Excel, TXT, and other file formats Barcode system: 1D or 2D codes

Server mode: Utilises a central server to centrally manage data from multiple AOI systems (optional)

Operating system: Windows XP with a 19-inch LCD monitor