DIP Plug-in Production Line play the following key roles in electronic manufacturing: Adapting to special components Suitable for high-power devices, high-frequency components, and irregular connectors that are not suitable for surface mount technology (SMT). The plug-in process involves soldering pins through PCB holes to ensure the stable installation and heat dissipation requirements of large components (such as relays and transformers). Enhancing structural reliability Through-hole soldering creates a mechanical interlock between the pins and the PCB, achieving a vibration test pass rate of 99.2% and a 40% increase in temperature cycle lifespan, far exceeding the strength of SMT solder joints. This makes DIP technology indispensable in high-reliability fields such as military and automotive electronics. Complementary SMT Process In dual-sided mixed-assembly boards, DIP handles high-power components on the back side (such as power interfaces), while SMT manages precision ICs on the front side, saving over 15% in layout space. The two processes collaborate to achieve full-process manufacturing of complex products. Standardised production process Includes four key stages: Component pre-processing: Trimming leads and establishing a polarity database; Manual insertion: Anti-static operations + dual-person mutual inspection to reduce misinsertion rates; Wave soldering control: Precise regulation of solder bath temperature at 245±3°C; Post-processing: Automatic lead trimming and three-proof coating process.
