Operating Procedure for PCB Pick-and-Place Machine

The pick-and-place machine is an automated device used in printed circuit board (PCB) production, whose operation must strictly adhere to safety protocols and technical specifications. The detailed operational steps are as follows:

I. Manual Debugging Procedure

Preparatory Work

Clear PCBs from the second material tray

Adjust track width and X-axis clamping mechanism mounting bracket according to PCB specifications

Positioning Adjustment

Access the touchscreen's [Manual Operation Screen], then select [Raising Tray] to reach the upper limit

Place the PCB and fine-tune the track width to ensure a 1–2mm gap between the clamping surface and the board

Adjust the suction gripper to the PCB's centre position and test the stability of the suction

Functional Testing

Check the suction signal via the [Suction Board] function

Test using multiple PCBs; should any board drop, re-adjust the fine-tuning

II. Automatic Operation Guidelines

Do not alter parameters during automatic operation

Do not open rear equipment doors before AGV arrival

Maintain ambient temperature below 30°C

III. Safety Precautions

Non-maintenance personnel must not open front/rear equipment doors

Never insert hands into interior during operation

Maintenance must be performed by qualified personnel following specifications

IV. Technical Parameters

Positioning accuracy: ±0.2mm (standard model) or ±0.05mm (high-precision model)

Production cycle: 8 seconds per board

Applicable dimensions: 50×50mm to 1200×460mm