Views: 0 Author: SHENGDIAN Publish Time: 2025-07-23 Origin: Site
Reflow soldering classification is primarily based on heating methods, while process requirements focus on temperature control, equipment operation, and quality verification, as detailed below:
1. Reflow Soldering Classification
Classified by heating area scope into two major categories:
Overall Heating Type (Mainstream Solution)
Hot Plate Reflow Soldering: Heats the PCB substrate via thermal conduction
Infrared Hot Air Reflow Soldering: Forced convection hot air + infrared radiation, with high heating uniformity
Vapour phase reflow soldering: Utilises the heat released by the condensation of inert liquid vapour, suitable for high-reliability applications
Localised heating type (special applications)
Laser reflow soldering: Precisely heats micro-solder joints using a focused laser beam
Focused infrared/beam reflow soldering: Directs radiation to specific areas
Hot air reflow soldering: Achieves local soldering by spraying high-temperature airflow
II. Core process requirements
1. Equipment operating specifications
Conveyor stability: Vibration is strictly prohibited; servo motors are used to drive the chain track to prevent component displacement
Nitrogen protection (optional): Nitrogen is used to reduce oxidation and improve the solder joint quality of high-end products such as automotive electronics
Temperature Zone Configuration: Lead-free processes require ≥8 temperature zones, with a heating length >2950mm to ensure temperature uniformity
2. Quality Verification Standards
First-piece Inspection: Confirm that solder joints are fully melted, with a smooth, semi-circular surface, and no bridging/cold solder joints/solder balls
Solder joint appearance: Wetting angle <60°, solder coverage of the pad >90%, strength >50N.
Defect prevention:
Porosity rate <3% (X-ray inspection).
Standing/bridging (control preheating slope ≤20°C/second).
Regular calibration of equipment parameters (mandatory testing per shift).