The Different Of SMT Semi-Automatic Solder Paste Printer And Automatic Printer

Printing machine series of fully automatic printing machine is from the loading of the P C B bare board to the completion of the printing output track, are automatically completed by the equipment. P C B board into the fully automatic printing machine, the equipment system will be fixed for precise positioning, P C B circuit board on each pad's coordinates of the location of the data has been entered in advance into the fully automatic S M T printing machine, printing before the stencil and the PCB board of the aperture alignment is still need to be manually completed, the formation of stencil leakage holes and P C B pads one-to-one corresponding positional relationship. Then, the equipment will be input in advance according to the scraper angle, strength data from left to right, and then from right to left scraping action, the solder paste leakage printing to the fixed P C B circuit board below. After completing the printing, it automatically loosens the fixed jam and puts the P C B board back to the track to convey it to the lower machine.

Here are the differences between the two: Fully automatic printing machines and semi-automatic printing machines are commonly used in the electronics manufacturing industry for printing P C B circuit boards, and they differ in function, operation and productivity.    

Functional differences: Fully automatic printing machine: Fully automatic printing machine has automatic loading and unloading, positioning, printing and cleaning functions. It is usually equipped with an advanced vision system and motion control technology, enabling a high-precision, high-quality printing process. Semi-automatic presses are relatively simplified and usually require manual loading, unloading, printing and cleaning. It requires an operator to place and remove the boards and lacks automatic positioning and vision systems.

Difference in operation: Fully automated presses complete the entire printing process through pre-set programs and parameters, reducing the workload of the operator. Operation usually requires regular monitoring and maintenance, and can be run independently most of the time. Semi-automatic presses rely on operators to perform manual placement and removal of P C B circuit boards, requiring human involvement and responsibility for operation. Due to the human factor, the demands on the operator are higher than with fully automated presses.

Difference in productivity: Fully automatic presses have a high degree of automation and printing accuracy, and can achieve high productivity depending on the configuration and performance of the equipment. It is suitable for high volume, high speed production needs. Semi-automatic presses: Semi-automatic presses have relatively low productivity due to the need for operator intervention. It is suitable for small to medium scale production, or less stringent production requirements. So you can choose a suitable printing machine according to your own situation. If the output is not high and the budget is not so big, you can choose this semi-automatic printing machine, which is more cost-effective.

Notes on the use of fully automatic printing machine: P C B circuit board through the tin position, line up the thimble, should be avoided to prevent the thimble stained tin, resulting in a batch of bad. Arrangement of the thimble, should avoid the thimble touching the two sides of the printing machine track, to prevent the printing process, resulting in the thimble shift, the top of the material. The thimble selection should be appropriate, eliminating the adsorption of unstable thimble. Program P C B plate thickness should be set appropriately, thimble row O K, P C B top plate height should be flush with the height of the two sides of the track. When lining up the thimble, P C B is not clamped first, when transferring the P C B circuit board, it should be clicked OFF, after the lining up is completed, click ON,clamp P C B and check whether the thimble tops the material or not. When using side clamps, the adjustment of air pressure value, if the P C B board is softer and thinner, the air pressure value should be adjusted to about 0.4 to 0.6 MPa, if it is a hard board, the air pressure value can be large, in addition, if you adjust the air pressure value in the middle of the process, it may have an impact on the printing offset, should be noted! Squeegee printing range of confirmation, the range should be adjusted appropriately, the range is too large, will cause waste of solder paste, as well as affect the production capacity, the range is too small, will cause printing leakage. MARK point selection, priority in order to prevent dull as the first consideration, in addition to MARK point of the search range should not be too large, to prevent the reference point of the wrong light, resulting in printing offset and other bad stencil cleaning, W I provisions of manual cleaning and automatic cleaning combined with the current production line only to automatic cleaning. Currently, the production line only to do the automatic cleaning of this action, in order to achieve good print quality, should be imported into the regular manual cleaning of the stencil, the production line printing position should be installed air guns to facilitate the staff online cleaning operations; or the actual operation of only using the automatic cleaning, the project needs to assess which models of the amount of larger and more frequent production, standby a stencil, every four hours to replace the stencil, will be dismantled to put automatic stencil cleaning machine, alternately using the stencil to clean the stencil, and then the stencil to clean the stencil, the stencil to clean the stencil. Cleaning machine for cleaning, alternate use, not only to protect the quality of printing, but also shorten the production line downtime, at the same time because of the existence of a spare stencil, employees accidentally top hurt the stencil, there are options, will not affect the product delivery. Wipe mode and wipe the number of settings, each time you change the line, you must confirm the check to see whether the parameters are set correctly and reasonably. Confirmation check of the width of the printing press track, in practice, in the case of no card board, the theory is that the smaller the width, the better, so that the P C B board has a small range of activities, even in the case of printing pressure set the wrong value of a large number of cases, the P C B line board is not easy to brush the bias, or else, it is extremely easy to brush the bias. Each time you turn the printing machine, please confirm that the printing effect is OK, there is no pulling the tip, off-set, leakage, less tin, even tin, etc., in the printing effect is good, before the normal flow of the board down, otherwise it is very easy to need to wash the board of the situation is as follows: directly from the printing machine to retrieve the program, the docking station to open the semi-automatic first, put the two boards down to confirm that the front and back of the squeegee printing offsets, after the S P I or artificial Visual inspection, there is no printing offset, and then open the full-automatic printing; when the printing machine new production program, P C B circuit board surface must be affixed to the P E film printing, until the adjustment of the printing machine offset until the normal printing.