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The main function of Automatic Solder Paste Printing Machine is to print the solder paste onto PCB. Through the precise control system, it can apply the solder paste evenly on the PCB, and at the same time, it can also adjust the thickness and position of the solder paste and other parameters finely, which can effectively guarantee the quality and productivity of SMT placement.
Product Features
1. Universal for large and small stencils, with good and wide applicability. Automatic stencil positioning system, saving time for wire change and improving overall efficiency.
2. Adopt uniform ring and high brightness coaxial light, advanced top and bottom vision
matching system. All-round light source compensation can identify all types of Mark dots and adapt to different color boards such as tinned, copper, gold covered, tin sprayed, FPC, etc. to ensure high precision machine alignment.
3. Automatic and effective stencil cleaning system, dry cleaning, wet cleaning vacuum
cleaning three ways can be freely combined, also can be manually cleaned stencil, CCD part and cleaning part separate design, when the CCD work, CCD independent movement, reduce the servo motor load and movement impulse, improve the accuracy and speed and
service life. Top-down spraying system, uniform spraying. Software function can control the alcohol and stencil paper, effectively save more consumables; vacuum cleaning with a special fan, strong and effective.
4. The three-axis linkage has super high dynamic characteristics and can quickly achieve PCB board thickness adjustment. The three-axis linkage has super high dynamic characteristics, which can quickly realize the PIN pin jacking height adjustment of PCB boards with different thickness.
5. The unique belt drive system effectively prevents cardboard from falling off. The
programmable motor controls the transport speed and stops the board in a precise position. The direction of left and right board entry and exit can be freely selected. Adopt flexible side clamping and vacuum suction cavity, effectively clamping PCB to ensure complete flat contact between PCB stencils.
6. Windows XP is an easy-to-learn and easy-to-use operating interface. Good human-machine dialogue function, teaching and navigation function for program files, each step is prompted for all operators to quickly familiarize themselves with the menu in English and Chinese. Operation logs, fault logs, analysis and diagnosis.
Technical Parameter
Model | A5 | |
Item | ||
Screen Frames | Min Size | 370*370mm |
Max Size | 737*737mm | |
Thickness | 25-40mm | |
PCB Min Size | 50*50mm | |
PCB Max Size | 400*340mm | |
PCB Thickness | 0.4-6mm | |
PCB Warpage | ＜1% | |
Transport Height | 900±40mm | |
Transport Direction | Left-Right/Right-Left/Left-Left/Right-Right | |
Transport Speed | Max 1500mm/s Programmable | |
PCB Board Location | Support System | Magnetic Pin/Up-down table adjusted/Support block by hand |
Clamping System | Side clamping/Vacuum nozzle/Automatic retractable Z-directional pressure board | |
Print Head | Two independent inline motor-driven print heads | |
Squeegee Speed | 6-200mm/s | |
Squeegee Pressure | 0-15KG motor control | |
Squeegee Angle | 60°/55°/45° | |
Squeegee Type | Stainless steel(standard),plastic | |
Stencil Separation Speed | 0.1-20mm/s Programmable | |
Cleaning System | Dry、Wet、Vacuum (Programmable) | |
Table Adjustment Ranges | X:±10mm; Y:±10mm; θ:±2° | |
CCD FOV | 8*6mm | |
Solder Paste Inspection | 2D Inspection | |
Repeat Position Accuracy | ±0.01mm | |
Printing Accuracy | ±0.025mm | |
Cycle Time | ＜7s (Exclude Printing& Cleaning) | |
Product Changeover | ＜5min | |
Air Required | 4.5-6kg/cm⊃2; | |
Power Supply | AC220V,50/60Hz | |
Control Method | PC Control | |
Machine Dimensions | 1220*1355*1500mm | |
Machine Weight | Approx:1000kg | |
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