The Working Principle of The Wave Soldering Spray Machine

The working principle of the wave soldering spray machine is to atomize the flux through a precise nozzle and evenly spray it on the soldering surface of the PCB board to remove oxides and reduce the surface tension of the solder, preparing for the subsequent soldering process.

The liquid flux is atomized into micron-sized particles by using ultrasonic or pneumatic nozzles (the coating thickness is usually controlled at 5-15μm). ‌ ‌

The nozzle can adjust the spray path and speed to adapt to different PCB board sizes. Some equipment supports selective spraying to save flux usage. ‌ ‌

The infrared sensor detects the entry of the PCB board and measures its width, triggering the start of the spray system. ‌ ‌

The transport guide rail precisely controls the position of the PCB board to ensure that the spray coating covers the pad and pin areas. ‌ ‌

The imported nozzle design ensures uniform atomization and anti-clogging, and is compatible with various fluxes (such as rosin type and no-clean type). ‌ ‌

The pressure regulation range is usually 3 to 4kg/cm², and the stability of the airflow is controlled by an electromagnetic valve. ‌ ‌

Parameters such as spray speed, path and dosage are set by programmable logic controller (PLC) or industrial computer, in compliance with IPC welding standards. ‌ ‌

Some high-end equipment is equipped with a visual monitoring system to provide real-time feedback on the spraying quality. ‌ ‌

Flux removes the oxide on the surface of the pads and pins, enhancing the wettability of the solder. ‌ ‌

Youdaoplaceholder0 thermal shock buffering ‌ : In the subsequent preheating stage (80-130℃), the solvent is further volatilized to prevent porosity during welding.